LT1637HS8#PBF Linear Technology, LT1637HS8#PBF Datasheet - Page 14

• Manufacturer Part Number: LT1637HS8#PBF
• Description: IC OPAMP R-R IN/OUT 1.1MHZ 8SOIC
• Manufacturer: Linear Technology
• Series: Over-The-Top®r

Specifications of LT1637HS8#PBF

• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.4 V/µs
• Gain Bandwidth Product: 1.1MHz
• Current - Input Bias: 17nA
• Voltage - Input Offset: 100µV
• Current - Supply: 230µA
• Current - Output / Channel: 31.7mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 44 V, ±1.35 V ~ 22 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -

LT1637
PACKAGE DESCRIPTIO
14
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(.0165 ± .0015)
0.42 ± 0.038
GAUGE PLANE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
TYP
2.38 ±0.05
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
U
0.254
(.010)
0.675 ±0.05
PACKAGE
OUTLINE
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
DETAIL “A”
0° – 6° TYP
(.0256)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
8-Lead Plastic MSOP
TOP MARK
(NOTE 6)
0.53 ± 0.152
(.021 ± .006)
MS8 Package
PIN 1
DD Package
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
SEATING
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
PLANE
4.90 ± 0.152
(.193 ± .006)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
1
8
7 6 5
2 3
0.00 – 0.05
4
1.65 ± 0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0205)
(.034)
(NOTE 4)
0.52
0.86
REF
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD) DFN 1203
1637fd