LT1112IS8#PBF Linear Technology, LT1112IS8#PBF Datasheet - Page 15
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LT1112IS8#PBF
Manufacturer Part Number
LT1112IS8#PBF
Description
IC OP AMP PREC DUAL LOPWR 8-SOIC
Manufacturer
Linear Technology
Type
General Purpose Amplifierr
Datasheet
1.LT1112CN8PBF.pdf
(16 pages)
Specifications of LT1112IS8#PBF
Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
0.3 V/µs
Gain Bandwidth Product
750kHz
Current - Input Bias
100pA
Voltage - Input Offset
25µV
Current - Supply
350µA
Voltage - Supply, Single/dual (±)
2 V ~ 40 V, ±1 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Rail/rail I/o Type
No
Number Of Elements
2
Unity Gain Bandwidth Product
0.75MHz
Common Mode Rejection Ratio
115dB
Input Offset Voltage
75uV
Input Bias Current
280pA
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±3/±5/±9/±12/±15/±18V
Voltage Gain In Db
133.98dB
Power Supply Rejection Ratio
114dB
Power Supply Requirement
Dual
Shut Down Feature
No
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±1V
Dual Supply Voltage (max)
±20V
Technology
Bipolar
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Current - Output / Channel
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTIO
.030 ±.005
(0.203 – 0.254)
.008 – .010
TYP
.245
MIN
(0.254 – 0.508)
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.010 – .020
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
N
1
.030 ±.005
.050 BSC
(0.406 – 1.270)
(0.203 – 0.254)
.016 – .050
2
.008 – .010
TYP
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.245
MIN
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
× 45°
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3
(MILLIMETERS)
(0.254 – 0.508)
INCHES
.010 – .020
.050 BSC
U
16-Lead Plastic Small Outline (Narrow .150 Inch)
8-Lead Plastic Small Outline (Narrow .150 Inch)
(0.406 – 1.270)
(MILLIMETERS)
0° – 8° TYP
N/2
.016 – .050
.045 ±.005
.160 ±.005
INCHES
× 45°
(Reference LTC DWG # 05-08-1610)
(Reference LTC DWG # 05-08-1610)
.045 ±.005
.160 ±.005
(5.791 – 6.197)
(1.346 – 1.752)
.228 – .244
.053 – .069
0°– 8° TYP
S8 Package
(0.355 – 0.483)
S Package
.014 – .019
TYP
(5.791 – 6.197)
.228 – .244
16
(1.346 – 1.752)
N
1
(0.355 – 0.483)
.053 – .069
.014 – .019
TYP
15
2
8
1
14
3
(4.801 – 5.004)
(9.804 – 10.008)
.189 – .197
7
2
NOTE 3
.386 – .394
13
4
NOTE 3
(1.270)
.050
BSC
6
3
12
5
5
4
11
6
(1.270)
.050
BSC
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
10
7
NOTE 3
SO8 0303
LT1112/LT1114
N/2
9
8
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
S16 0502
15
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