ADA4841-2YRZ Analog Devices Inc, ADA4841-2YRZ Datasheet - Page 20
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ADA4841-2YRZ
Manufacturer Part Number
ADA4841-2YRZ
Description
IC OPAMP VF R-R DUAL LP LN 8SOIC
Manufacturer
Analog Devices Inc
Datasheet
1.ADA4841-1YRZ-R7.pdf
(20 pages)
Specifications of ADA4841-2YRZ
Slew Rate
13 V/µs
Amplifier Type
Voltage Feedback
Number Of Circuits
2
Output Type
Rail-to-Rail
-3db Bandwidth
80MHz
Current - Input Bias
3µA
Voltage - Input Offset
40µV
Current - Supply
1.5mA
Current - Output / Channel
60mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 12 V, ±1.35 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
Low Power
No. Of Amplifiers
2
Bandwidth
80MHz
Supply Voltage Range
2.7V To 12V
Amplifier Case Style
SOIC
No. Of Pins
8
Operating Temperature Range
-40°C To +125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADA4841-2YRZ
Manufacturer:
ADI
Quantity:
1 350
Part Number:
ADA4841-2YRZ-R7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADA4841-1/ADA4841-2
ORDERING GUIDE
Model
ADA4841-1YRZ
ADA4841-1YRZ-R7
ADA4841-1YRZ-RL
ADA4841-1YRJZ-R2
ADA4841-1YRJZ-R7
ADA4841-1YRJZ-RL
ADA4841-2YRMZ
ADA4841-2YRMZ-R7
ADA4841-2YRMZ-RL
ADA4841-2YRZ
ADA4841-2YRZ-R7
ADA4841-2YRZ-RL
ADA4841-2YCPZ-R2
ADA4841-2YCPZ-R7
ADA4841-2YCPZ-RL
ADA4841-1YR-EBZ
ADA4841-1YRJ-EBZ
ADA4841-2YRM-EBZ
ADA4841-2YR-EBZ
1
©2005–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PIN 1 INDEX
SEATING
PLANE
AREA
0.80
0.75
0.70
D05614–0–12/10(E)
Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
0.30
0.25
0.20
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
TOP VIEW
3.10
3.00 SQ
2.90
3 mm × 3 mm Body, Very Very Thin, Dual Lead
Package Description
8-Lead SOIC_N
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
8-Lead SOIC_N
Evaluation Board
Evaluation Board
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead LFCSP_WD
8-Lead LFCSP_WD
8-Lead LFCSP_WD
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
Rev. E | Page 20 of 20
0.203 REF
(CP-8-11)
0.50
0.40
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
5
4
BOTTOM VIEW
Package Option
R-8
R-8
R-8
RJ-6
RJ-6
RJ-6
RM-8
RM-8
RM-8
R-8
R-8
R-8
CP-8-11
CP-8-11
CP-8-11
2.54
2.44
2.34
EXPOSED
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION
OF THIS DATA SHEET.
PAD
1
8
0.50 BSC
1.80
1.70
1.60
Ordering Quantity
1
1,000
2,500
250
3,000
10,000
1
1,000
3,000
1
1,000
2,500
250
1,500
5,000
Branding
HQB
HQB
HQB
HRB
HRB
HRB
HRB
HRB
HRB