HA3-5002-5Z Intersil, HA3-5002-5Z Datasheet - Page 3

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HA3-5002-5Z

Manufacturer Part Number
HA3-5002-5Z
Description
IC BUFFER 110MHZ HIGH OUT 8-DIP
Manufacturer
Intersil
Type
High Output, High Slew Rater
Datasheets

Specifications of HA3-5002-5Z

Amplifier Type
Buffer
Number Of Circuits
1
Slew Rate
1300 V/µs
-3db Bandwidth
110MHz
Current - Input Bias
2µA
Voltage - Input Offset
5000µV
Current - Supply
8.3mA
Current - Output / Channel
220mA
Voltage - Supply, Single/dual (±)
10 V ~ 40 V, ±5 V ~ 20 V
Operating Temperature
0°C ~ 75°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Bandwidth
110 MHz
Current, Input Bias
2 μA
Current, Output
220 mA
Current, Supply
8.3 mA
Harmonic Distortion
0.005 %
Impedance, Thermal
92 °C/W
Number Of Amplifiers
Single
Package Type
PDIP-8
Propagation Delay
2 ns
Resistance, Input
3 Megohms
Temperature, Operating, Range
0 to +75 °C
Time, Rise
3.6 ns
Voltage, Gain
0.995 V/V
Voltage, Input Offset
5 mV
Voltage, Noise
18 μVp-p
Voltage, Output Swing
±13.9 V
Voltage, Supply
±15 V
No. Of Amplifiers
1
Gain Bandwidth
110MHz
Supply Voltage Range
± 12V To ± 15V
Output Current
220mA
Amplifier Output
Single Ended
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HA3-5002-5Z
Manufacturer:
Intersil
Quantity:
900
Part Number:
HA3-5002-5Z
Manufacturer:
Intersil
Quantity:
2 000
Absolute Maximum Ratings
Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . . . . . . . 44V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Output Current (Continuous) . . . . . . . . . . . . . . . . . . . . . . . . ±200mA
Output Current (50ms On, 1s Off) . . . . . . . . . . . . . . . . . . . . ±400mA
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
INPUT CHARACTERISTICS
Offset Voltage
Average Offset Voltage Drift
Bias Current
Input Resistance
Input Noise Voltage
TRANSFER CHARACTERISTICS
Voltage Gain
(V
-3dB Bandwidth
AC Current Gain
OUTPUT CHARACTERISTICS
Output Voltage Swing
Output Current
Output Resistance
Harmonic Distortion
TRANSIENT RESPONSE
Full Power Bandwidth (Note 3)
Rise Time
Propagation Delay
Overshoot
Slew Rate
Settling Time
1. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below 175°C for the
2. θ
HA-5002-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to 125°C
HA-5002-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 75°C
HA-5002-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
OUT
can packages, and below 150°C for the plastic packages.
JA
= ±10V)
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
3
V
10Hz-1MHz
R
R
R
R
V
R
R
R
V
V
To 0.1%
SUPPLY
IN
IN
IN
L
L
L
L
L
L
L
= 50Ω
= 100Ω
= 1kΩ
= 1kΩ
= 100Ω
= 1kΩ, V
= 1kΩ, V
= 1V
= ±10V, R
= 1V
CONDITIONS
= ±12V to ±15V, R
P-P
RMS
TEST
S
S
, f = 10kHz
= ±15V
= ±12V
L
= 40Ω
1
+ to V
TEMP
S
(°C)
Full
Full
Full
Full
Full
Full
Full
Full
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
1
= 50Ω, R
HA-5002
-
0.980
MIN
±10
±10
±10
1.5
1.0
L
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
= 1kΩ, C
Thermal Information
Thermal Resistance (Typical, Note 2)
Max Junction Temperature (Hermetic Packages, Note 1) . . . . . . 175°C
Max Junction Temperature (Plastic Packages, Note 1) . . . . . . . . 150°C
Max Storage Temperature Range . . . . . . . . . . . . . . -65°C to 150°C
Max Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . 300°C
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
PDIP Package*. . . . . . . . . . . . . . . . . . .
Metal Can Package . . . . . . . . . . . . . . .
PLCC Package. . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . .
(PLCC and SOIC - Lead Tips Only)
HA-5002-2
<0.005
0.900
0.971
0.995
±10.7
±13.5
±10.5
TYP
20.7
110
220
3.4
3.6
1.3
10
30
18
40
30
50
L
5
2
3
3
2
-
= 10pF, Unless Otherwise Specified
MAX
20
30
10
10
7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.980
MIN
±10
±10
±10
1.5
1.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
HA-5002-5, -9
<0.005
0.900
0.971
0.995
±11.2
±13.9
±10.5
TYP
20.7
110
220
2.4
3.6
1.3
10
30
18
40
30
50
5
2
3
3
2
-
θ
JA
155
157
(°C/W)
92
74
MAX
20
30
10
10
7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
θ
March 8, 2006
JC
UNITS
FN2921.11
µV
µV/°C
A/mA
N/A
N/A
N/A
MHz
MHz
V/ns
(°C/W)
67
V/V
V/V
V/V
V/V
mV
mV
MΩ
mA
µA
µA
ns
ns
ns
%
%
V
V
V
P-P

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