MC33074APG ON Semiconductor, MC33074APG Datasheet - Page 21

IC OPAMP QUAD 4.5MHZ 14DIP

MC33074APG

Manufacturer Part Number
MC33074APG
Description
IC OPAMP QUAD 4.5MHZ 14DIP
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC33074APG

Amplifier Type
General Purpose
Number Of Circuits
4
Slew Rate
13 V/µs
Gain Bandwidth Product
4.5MHz
Current - Input Bias
100nA
Voltage - Input Offset
500µV
Current - Supply
1.9mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 44 V, ±1.5 V ~ 22 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Channels
4
Common Mode Rejection Ratio (min)
80 dB
Input Voltage Range (max)
Positive Rail - 1.8 V
Input Voltage Range (min)
Negative Rail
Input Offset Voltage
3 mV
Input Bias Current (max)
500 nA
Operating Supply Voltage
44 V
Supply Current
7.6 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage
+/- 22 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
Through Hole
Shutdown
No
Supply Voltage (max)
44 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33074APGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33074APG
Quantity:
2 000
Part Number:
MC33074APG
Manufacturer:
ON Semiconductor
Quantity:
22
Part Number:
MC33074APG
Manufacturer:
FRE/MOT
Quantity:
20 000
SEATING
PLANE
−T−
NOTE 5
N
A1
D1
H
e/2
14
1
1
8
e
TOP VIEW
SIDE VIEW
D
G
A
F
5
4
F
8X
A
A
b
E1
L
7
0.010
8
D
0.13 (0.005)
C
14 PL
SEATING
PLANE
M
B
C
C A
K
PACKAGE DIMENSIONS
M
c
http://onsemi.com
J
CASE 646−06
CASE 626−05
8 LEAD PDIP
PDIP−14
ISSUE P
ISSUE M
END VIEW
END VIEW
NOTE 3
E2
E3
21
E
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION E IS MEASURED WITH THE LEADS RE-
4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1994.
STRAINED PARALLEL AT WIDTH E2.
DIM
A1
D1
E1
E2
E3
NOTES:
A
C
D
E
b
e
L
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
Y14.5M, 1982.
FORMED PARALLEL.
M
A
B
C
D
G
H
K
N
0.015
0.014
0.008
0.355
0.005
0.300
0.240
F
J
L
0.115
−−−−
−−−−
MIN
0.715
0.240
0.145
0.015
0.040
0.052
0.008
0.290
0.015
0.115
MIN
0.300 BSC
0.100 BSC
−−−
0.100 BSC
INCHES
0.018
0.010
0.365
0.310
0.250
0.130
NOM
−−−−
−−−−
−−−−
−−−−
INCHES
0.770
0.260
0.185
0.021
0.070
0.095
0.015
0.135
0.310
0.039
MAX
10
0.210
0.022
0.014
0.400
0.325
0.280
0.430
0.150
−−−−
−−−−
MAX
_
18.16
MILLIMETERS
MIN
6.10
3.69
0.38
1.02
1.32
0.20
2.92
7.37
0.38
−−−
2.54 BSC
MIN
−−−−
−−−−
0.38
0.35
0.20
9.02
0.13
7.62
6.10
2.92
MILLIMETERS
19.56
7.62 BSC
2.54 BSC
MAX
6.60
4.69
0.53
1.78
2.41
0.38
3.43
7.87
1.01
10
NOM
−−−−
−−−−
−−−−
−−−−
0.46
0.25
9.27
7.87
6.35
3.30
_
MAX
10.02
10.92
−−−−
−−−−
5.33
0.56
0.36
8.26
7.11
3.81

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