MCP6051-E/SN Microchip Technology, MCP6051-E/SN Datasheet - Page 13

• Manufacturer Part Number: MCP6051-E/SN
• Description: IC OPAMP R-R 1.8V 30UA 8-SOIC
• Manufacturer: Microchip Technology

Specifications of MCP6051-E/SN

• Slew Rate: 0.15 V/µs
• Package / Case: 8-SOIC (3.9mm Width)
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 385kHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 150µV
• Current - Supply: 30µA
• Current - Output / Channel: 26mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 72 dB
• Input Offset Voltage: 0.15 mV
• Input Bias Current (max): 100 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 6 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 115 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.0
Descriptions of the pins are listed in
TABLE 3-1:
3.1
The output pins are low-impedance voltage sources.
3.2
The non-inverting and inverting inputs are high-
impedance CMOS inputs with low bias currents.
© 2010 Microchip Technology Inc.
1, 5, 8
SOIC
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6
2
3
7
4
PIN DESCRIPTIONS
Analog Outputs
Analog Inputs
SOT-23-5 2x3 TDFN
MCP6051
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1
4
3
5
2
PIN FUNCTION TABLE
1, 5, 8
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6
2
3
7
4
9
SOIC
Table
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1
2
3
8
5
6
7
4
MCP6052
3-1.
2x3 TDFN
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1
2
3
8
5
6
7
4
9
MCP6054
TSSOP
SOIC,
10
11
12
13
14
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1
2
3
4
5
6
7
8
9
3.3
The positive power supply (V
than the negative power supply (V
operation, the other pins are at voltages between V
and V
Typically, these parts are used in a single (positive)
supply configuration. In this case, V
ground and V
need bypass capacitors.
3.4
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the V
be connected to the same potential on the Printed
Circuit Board (PCB).
DD
V
V
V
.
OUT
IN
Power Supply Pins
Exposed Thermal Pad (EP)
IN
Symbol
V
V
V
V
V
V
V
V
V
+, V
–, V
V
V
OUTC
OUTD
OUTB
NC
INC
IND
EP
INB
INB
INC
IND
, V
DD
SS
DD
OUTA
INA
INA
+
–
–
+
+
–
is connected to the supply. V
–
+
MCP6051/2/4
Analog Output (op amp A)
Inverting Input (op amp A)
Non-inverting Input (op amp A)
Positive Power Supply
Non-inverting Input (op amp B)
Inverting Input (op amp B)
Analog Output (op amp B)
Analog Output (op amp C)
Inverting Input (op amp C)
Non-inverting Input (op amp C)
Negative Power Supply
Non-inverting Input (op amp D)
Inverting Input (op amp D)
Analog Output (op amp D)
No Internal Connection
Exposed Thermal Pad (EP);
must be connected to V
DD
) is 1.8V to 6.0V higher
Description
SS
DS22182B-page 13
SS
SS
is connected to
). For normal
pin; they must
SS
DD
.
will
SS