MC34072APG ON Semiconductor, MC34072APG Datasheet - Page 24

• Manufacturer Part Number: MC34072APG
• Description: IC OPAMP DUAL SGL SUPP HS 8DIP
• Manufacturer: ON Semiconductor

Specifications of MC34072APG

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 13 V/µs
• Gain Bandwidth Product: 4.5MHz
• Current - Input Bias: 100nA
• Voltage - Input Offset: 500µV
• Current - Supply: 1.9mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 3 V ~ 44 V, ±1.5 V ~ 22 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 80 dB
• Input Voltage Range (max): Positive Rail - 1.8 V
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 3 mV
• Input Bias Current (max): 500 nA
• Operating Supply Voltage: 44 V
• Supply Current: 3.8 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V, +/- 9 V
• Maximum Dual Supply Voltage: +/- 22 V
• Minimum Dual Supply Voltage: +/- 1.5 V
• Mounting Style: Through Hole
• Shutdown: No
• Supply Voltage (max): 44 V
• Supply Voltage (min): 3 V
• Technology: Bipolar
• Voltage Gain Db: 100 dB
• Bandwidth: 4.5 MHz
• Channel Separation: 120
• Common Mode Rejection Ratio: 97
• Current, Input Bias: 700 nA
• Current, Input Offset: 300 nA
• Current, Output: 30 mA
• Current, Supply: 2.8 mA
• Harmonic Distortion: 0.02 %
• Number Of Amplifiers: Dual
• Package Type: PDIP-8
• Resistance, Input: 150 Megohms
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Gain: 25 V/mV
• Voltage, Input: ±15 V
• Voltage, Noise: 32 nV/sqrt Hz
• Voltage, Offset: 5 mV
• Voltage, Output, High: 13.4 V
• Voltage, Output, Low: -13.5 V
• Voltage, Supply: 3 to 44 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC34072APGOS

SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
0.58
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
14X
T
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
1
http://onsemi.com
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE J
M
7.04
7X
B
24
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_