MCP6272-E/SN Microchip Technology, MCP6272-E/SN Datasheet
MCP6272-E/SN
Specifications of MCP6272-E/SN
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MCP6272-E/SN Summary of contents
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... SOT-23-5 SOT-23 OUT – MCP6274 PDIP, SOIC, TSSOP OUTA INA INA INB INB OUTB + 300 – 300 mV MCP6272 PDIP, SOIC, MSOP OUTA INA OUTB INA V – INB INB MCP6275 PDIP, SOIC, MSOP V OUTD OUTA INB IND OUTB INA V + IND INB INA ...
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... V (Note µV/° -40°C to +125° (Note (Note Note +85°C (Note +125°C (Note Note 3 ||pF Note 3 ||pF Note 3 V Note -0.3V to 2.5V -0.3V to 5.3V 0. – 0.2V, OUT (Note µ 100 – 100 mV and 2004 Microchip Technology Inc. ...
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... Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: The Junction Temperature (T 2004 Microchip Technology Inc. MCP6271/2/3/4/5 = +25° +2.0V to +5.5V and pF Sym ...
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... ON — 0.01 — OFF — 0.6 — HYST ). OUTB OFF Hi-Z -0.7 µA (typ.) 0.7 µA (typ.) = GND, SS Units Conditions V µ µ µ µ µs CS Low 0 OUT 5.0V DD µs CS High OUT 2004 Microchip Technology Inc. ...
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... T = +85°C. A 300 V = 2.0V DD 250 200 150 100 50 0 -50 -100 Common Mode Input Voltage (V) FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage 2004 Microchip Technology Inc. MCP6271/2/3/4/5 = +2.0V to +5.5V GND 14% 832 Samples V 12 -40°C to +125° FIGURE 2-4: ...
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... Ambient Temperature (°C) Input Bias, Input Offset CMRR PSRR 100 125 Ambient Temperature (°C) CMRR, PSRR vs. Ambient Input Bias Current Input Offset Current Common Mode Input Voltage (V) Input Bias, Offset Currents = +125°C. A 2004 Microchip Technology Inc. ...
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... Frequency (Hz) FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency 5. 2. 0.1 1k 10k 100k 1M Frequency (Hz) FIGURE 2-15: Maximum Output Voltage Swing vs. Frequency. 2004 Microchip Technology Inc. MCP6271/2/3/4/5 = +2.0V to +5.5V GND 1000 100 T = +125° +85° +25° -40° 4.0 4 ...
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... FIGURE 2-22: vs. Common Mode Input Voltage at 1 kHz. 140 130 120 110 100 4.0 4.5 5.0 5.5 1 FIGURE 2-23: Separation vs. Frequency (MCP6272 and MCP6274). 700 V DD 600 500 400 300 200 100 0 1.6 1.8 2.0 0.0 FIGURE 2-24: Chip Select (CS) Voltage at V (MCP6273 and MCP6275 only) ...
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... Output High-Z 0.0 -5.0 0.0 5.0 10.0 15.0 20.0 25.0 Time (5 µs/div) FIGURE 2-27: Chip Select (CS) to Amplifier Output Response Time at V (MCP6273 and MCP6275 only). 2004 Microchip Technology Inc. MCP6271/2/3/4/5 = +2.0V to +5.5V GND 5 +1V/V 4 5.0V DD 4.0 3.5 3.0 2 ...
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... PIN FUNCTION TABLE FOR SINGLE OP AMPS MCP6271 MCP6271 MCP6271R (PDIP, SOIC, (SOT-23-5) (SOT-23-5) MSOP — — — 1,5,8 — — TABLE 3-2: PIN FUNCTION TABLE FOR DUAL AND QUAD OP AMPS. MCP6272 MCP6274 MCP6275 1 1 — — — 8 — — 9 — — ...
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... SS DD current to flow into or out of the input pins. Current beyond ±2 mA can cause reliability Applications that exceed this rating must be externally limited with a resistor, as shown in Figure 4-2. 2004 Microchip Technology Inc. MCP6271/2/3/4 battery-powered FIGURE 4-2: Resistor (R 4.2 Rail-to-Rail Output ...
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... An example of this type of layout is illustrated in Figure 4-6. V – INB OUTA INB OUTB A MCP6275 5 CS Cascaded Gain Amplifier. 6 pF – 300 mV and SS and V (20 mV from the rails with a OH – 20 mV. DD for single supply) should have a local difference would 2004 Microchip Technology Inc. ...
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... V REF Input V REF time FIGURE 4-7: The design equations give a gain of ±1 from and produce rail-to-rail outputs. OUT – Op Amp OUT 1/2 MCP6272 V REF D1 --------------------------- - – – V REF ------------ 1/2 MCP6272 Output V REF time Active Full-wave Rectifier. IN DS21810D-page 13 to ...
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... OSB Therefore recommended that you set most of the gain with op amp A and use op amp B with relatively small gain (e.g., a unity-gain buffer). Load Isolation V B OUTB Load MCP6275 CS Isolating the Load with a Cascaded Gain OSA A B OSB B 2004 Microchip Technology Inc. ...
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... This circuit uses op amp unity-gain buffer to isolate the integration capacitor C from op amp A and drives the capacitor 1 with a low-impedance source. Since both op amps are matched very well, they provide a high-quality integrator. 2004 Microchip Technology Inc. MCP6271/2/3/4 ...
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... requirements. OUT REF FIGURE 4-15: Low-Pass Filter with Chip Select. Capacitorless Second-Order Low-Pass filter with Chip Select are used to set the circuit gain Note that the amplifier OUT MCP6275 CS Capacitorless Second-Order 2004 Microchip Technology Inc. 3 ...
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... The FilterLab software tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. 2004 Microchip Technology Inc. MCP6271/2/3/4/5 for the DS21810D-page 17 ...
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... For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. DS21810D-page 18 Device Code MCP6271 CGNN MCP6271R ETNN Note: Applies to 5-Lead SOT-23 Example: CG25 Example: CK25 Example: 6271E 437256 Example: MCP6271 E/P256 0437 Example: MCP6271 E/SN0437 256 2004 Microchip Technology Inc. ...
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... Package Marking Information (Continued) 14-Lead PDIP (300 mil) (MCP6274) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN 14-Lead SOIC (150 mil) (MCP6274) XXXXXXXXXX XXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6274) XXXXXX YYWW NNN 2004 Microchip Technology Inc. MCP6271/2/3/4/5 Example: MCP6274-E/P 0437256 Example: MCP6274ESL 0437256 Example: 6274EST 0437 256 DS21810D-page 19 ...
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... A2 MILLIMETERS MIN NOM MAX 5 0.95 1.90 0.90 1.18 1.45 0.90 1.10 1.30 0.00 0.08 0.15 2.60 2.80 3.00 1.50 1.63 1.75 2.80 2.95 3.10 0.35 0.45 0. 0.09 0.15 0.20 0.35 0.43 0. 2004 Microchip Technology Inc. ...
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... Mold Draft Angle Top Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 2004 Microchip Technology Inc. MCP6271/2/3/4 φ A1 ...
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... A2 MILLIMETERS* MIN NOM MAX 8 0.65 BSC - - 1.10 0.75 0.85 0.95 0.00 - 0.15 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.80 0.95 REF 0° - 8° 0.08 - 0.23 0.22 - 0.40 5° - 15° 5° - 15° 2004 Microchip Technology Inc. ...
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... Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2004 Microchip Technology Inc. MCP6271/2/3/4 ...
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... A2 MILLIMETERS MIN NOM MAX 8 1.27 1.35 1.55 1.75 1.32 1.42 1.55 0.10 0.18 0.25 5.79 6.02 6.20 3.71 3.91 3.99 4.80 4.90 5.00 0.25 0.38 0.51 0.48 0.62 0. 0.20 0.23 0.25 0.33 0.42 0. 2004 Microchip Technology Inc. ...
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... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005 2004 Microchip Technology Inc. MCP6271/2/3/4 Units ...
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... A2 MILLIMETERS MIN NOM MAX 14 1.27 1.35 1.55 1.75 1.32 1.42 1.55 0.10 0.18 0.25 5.79 5.99 6.20 3.81 3.90 3.99 8.56 8.69 8.81 0.25 0.38 0.51 0.41 0.84 1. 0.20 0.23 0.25 0.36 0.42 0. 2004 Microchip Technology Inc. ...
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... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087 2004 Microchip Technology Inc. MCP6271/2/3/4 Units ...
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... MCP6271/2/3/4/5 NOTES: DS21810D-page 28 2004 Microchip Technology Inc. ...
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... Added Section 3.0 “Pin Descriptions”. 4. Corrected application circuits (Section 4.8 “Application Circuits”). 5. Added SOT-23-5 and SOT-23-6 packages and corrected package marking (Section 6.0 “Packaging Information”). 6. Added Appendix A: Revision History. 2004 Microchip Technology Inc. MCP6271/2/3/4/5 information DS21810D-page 29 ...
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... MCP6271/2/3/4/5 NOTES: DS21810D-page 30 2004 Microchip Technology Inc. ...
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... Extended Temperature, 8LD MSOP package. c) MCP6271-E/P: Extended Temperature, 8LD PDIP package. d) MCP6271T-E/OT: Tape and Reel, Extended Temperature, 5LD SOT-23 package. a) MCP6272-E/SN: Extended Temperature, 8LD SOIC package. b) MCP6272-E/MS: Extended Temperature, 8LD MSOP package. c) MCP6272-E/P: Extended Temperature, 8LD PDIP package. d) MCP6272T-E/SN: Tape and Reel, Extended Temperature, 8LD SOIC package ...
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... MCP6271/2/3/4/5 NOTES: DS21810D-page 32 2004 Microchip Technology Inc. ...
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... PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 2004 Microchip Technology Inc. EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 ...