LT1813CS8#PBF Linear Technology, LT1813CS8#PBF Datasheet - Page 14
![IC OPAMP LOWPWR HISPD DUAL 8SOIC](/photos/12/54/125460/lt1813cs8_pbf_sml.jpg)
LT1813CS8#PBF
Manufacturer Part Number
LT1813CS8#PBF
Description
IC OPAMP LOWPWR HISPD DUAL 8SOIC
Manufacturer
Linear Technology
Datasheet
1.LT1814CSPBF.pdf
(16 pages)
Specifications of LT1813CS8#PBF
Amplifier Type
Voltage Feedback
Number Of Circuits
2
Slew Rate
750 V/µs
Gain Bandwidth Product
100MHz
-3db Bandwidth
200MHz
Current - Input Bias
900nA
Voltage - Input Offset
500µV
Current - Supply
3mA
Current - Output / Channel
60mA
Voltage - Supply, Single/dual (±)
2.5 V ~ 12.6 V, ±1.25 V ~ 6.3 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LT1813/LT1814
PACKAGE DESCRIPTIO
14
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.28 ± 0.05
(.0165 ± .0015)
0.42 ± 0.04
GAUGE PLANE
2.38 ±0.05
(.077)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(2 SIDES)
0.18
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.50
BSC
(.010)
0.254
0.675 ±0.05
U
PACKAGE
OUTLINE
DETAIL “A”
DETAIL “A”
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1698)
0° – 6° TYP
0.889 ± 0.127
(.0256)
TOP MARK
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
8-Lead Plastic MSOP
PIN 1
(.021 ± .006)
0.53 ± 0.015
0.200 REF
MS8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
SEATING
PLANE
(1.93 ± .006)
(.118 ± .004)
3.00 ± 0.102
4.90 ± 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
0.65
BSC
1
8
7 6 5
2 3
0.00 – 0.05
4
(.118 ± .004)
3.00 ± 0.102
1.65 ± 0.10
(.206)
(2 SIDES)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 ± .003)
0.13 ± 0.076
MSOP (MS8) 0802
BOTTOM VIEW—EXPOSED PAD
0.28 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 0203
18134fa