LTC2051HMS8 Linear Technology, LTC2051HMS8 Datasheet - Page 10

• Manufacturer Part Number: LTC2051HMS8
• Description: IC OP-AMP ZERO-DRIFT DUAL 8-MSOP
• Manufacturer: Linear Technology

Specifications of LTC2051HMS8

• Amplifier Type: Chopper (Zero-Drift)
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 2 V/µs
• Gain Bandwidth Product: 3MHz
• Current - Input Bias: 90pA
• Voltage - Input Offset: 1µV
• Current - Supply: 850µA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 7 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Output / Channel: -
• -3db Bandwidth: -

PACKAGE DESCRIPTIO
LTC2051/LTC2052
10
GAUGE PLANE
(.007)
0.18
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.010)
0.254
GAUGE PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.007)
0.18
DETAIL “A”
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
DETAIL “A”
0° – 6° TYP
(.010)
0.254
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
DETAIL “A”
DETAIL “A”
(.009 – .015)
0.22 – 0.38
0° – 6° TYP
TYP
U
(.021 ± .006)
0.53 ± 0.152
(.043)
1.10
MAX
(.0256)
0.65
BSC
SEATING
PLANE
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1661)
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
4.90 ± 0.152
(.193 ± .006)
0.17 – 0.27
(NOTE 3)
8-Lead Plastic MSOP
10-Lead Plastic MSOP
TYP
MS8 Package
(.043)
1.10
MAX
(.034)
MS Package
0.86
REF
0.127 ± 0.076
(.005 ± .003)
(.0197)
10
0.50
BSC
1 2 3 4 5
9
8
7 6
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(NOTE 3)
(.118 ± .004)
3.00 ± 0.102
(.0196 ± .003)
0.497 ± 0.076
(.034)
(NOTE 4)
0.86
REF
0.127 ± 0.076
(.005 ± .003)
REF
1
(.0120 ± .0015)
8
0.305 ± 0.038
7 6 5
2 3
TYP
(.206)
5.23
MIN
4
RECOMMENDED SOLDER PAD LAYOUT
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
0.52
REF
(.0165 ± .0015)
0.42 ± 0.038
TYP
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
MSOP (MS) 0603
(.0197)
0.50
BSC
MSOP (MS8) 0204
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
20512fd