LT6604CUFF-15#PBF Linear Technology, LT6604CUFF-15#PBF Datasheet - Page 13

• Manufacturer Part Number: LT6604CUFF-15#PBF
• Description: IC AMP DIFF LN DUAL 34-QFN
• Manufacturer: Linear Technology

Specifications of LT6604CUFF-15#PBF

• Amplifier Type: Differential
• Number Of Circuits: 2
• Output Type: Differential
• Current - Input Bias: 35µA
• Voltage - Input Offset: 10000µV
• Current - Supply: 38mA
• Voltage - Supply, Single/dual (±): 3 V ~ 11 V, ±1.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 34-QFN
• No. Of Amplifiers: 2
• Input Offset Voltage: 35mV
• Bandwidth: 15MHz
• Supply Voltage Range: 3V To 11V
• Supply Current: 38mA
• Amplifier Case Style: QFN
• No. Of Pins: 34
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -
• Slew Rate: -
• Gain Bandwidth Product: -

APPLICATIONS INFORMATION
Figure 8 is plot of the noise spectral density as a function
of frequency for an LT6604-15 with R
the fi xture of Figure 7 (the instrument noise has been
subtracted from the results). The noise at each output
is comprised of a differential component and a common
mode component. Using a transformer or combiner to
convert the differential outputs to single-ended signal
rejects the common mode noise and gives a true measure
of the S/N achievable in the system. Conversely, if each
output is measured individually and the noise power added
together, the resulting calculated noise level will be higher
than the true differential noise.
Power Dissipation
The LT6604-15 amplifi ers combine high speed with large
signal currents in a small package. There is a need to en-
sure that the die’s junction temperature does not exceed
150°C. The LT6604-15 has an Exposed Pad (pin 35) which
is connected to the lower supply (V
to a ground plane helps to dissipate the heat generated
by the chip. Metal trace and plated through-holes can be
used to spread the heat generated by the device to the
backside of the PC board.
Junction temperature, T
temperature, T
dissipation is the product of supply voltage, V
V
IN
R
R
A
IN
IN
, and power dissipation, P
34
4
6
2
1/2
LT6604-15
–
+
–2.5V
25
2.5V
7
+
–
J
0.1μF
0.1μF
, is calculated from the ambient
Figure 7
27
29
25Ω
25Ω
–
). Connecting the pad
COILCRAFT
TTWB-1010
1:1
IN
= 536Ω using
D
. The power
SPECTRUM
ANALYZER
INPUT
660415 F07
50Ω
S
, and
supply current, I
is given by:
where the supply current, I
impedance, temperature and common mode voltages. For
a given supply voltage, the worst-case power dissipation
occurs when the differential input signal is maximum, the
common mode currents are maximum (see Applications
Information regarding Common Mode DC Currents), the
load impedance is small and the ambient temperature is
maximum. To compute the junction temperature, measure
the supply current under these worstcase conditions, use
34°C/W as the package thermal resistance, then apply the
equation for TJ. For example, using the circuit in Figure 3
with DC differential input voltage of 250mV, a differential
output voltage of 1V, no load resistance and an ambient
temperature of 85°C, the supply current (current into V
measures 50mA The resulting junction temperature is:
T
The thermal resistance can be affected by the amount of
copper on the PCB that is connected to V
resistance of the circuit can increase if the exposed pad
is not connected to a large ground plane with a number
of vias.
J
T
= T
J
= T
A
+ (P
A
+ (P
Figure 8. Input Referred Noise, Gain = 1
45
40
35
30
25
20
15
10
D
5
0
0.01
• θ
D
• θ
S
JA
. Therefore, the junction temperature
NOISE DENSITY,
GAIN = 1x
NOISE DENSITY,
GAIN = 4x
INTEGRATED NOISE,
GAIN = 1x
INTEGRATED NOISE,
GAIN = 4x
JA
) = 85 + (5 • 2 • 0.05 • 34) = 102°C.
0.1
) = T
FREQUENCY (MHz)
S
A
, is a function of signal level, load
+ (V
1
S
• I
S
10
LT6604-15
• θ
660415 F08
JA
–
)
. The thermal
100
180
160
140
120
100
80
60
40
20
0
13
660415fb
+
)