OP97FS Analog Devices Inc, OP97FS Datasheet - Page 2
![IC OPAMP GP LP PREC 8SOIC](/photos/5/66/56684/505-8-soic_sml.jpg)
OP97FS
Manufacturer Part Number
OP97FS
Description
IC OPAMP GP LP PREC 8SOIC
Manufacturer
Analog Devices Inc
Datasheet
1.OP97FPZ.pdf
(16 pages)
Specifications of OP97FS
Slew Rate
0.2 V/µs
Rohs Status
RoHS non-compliant
Amplifier Type
General Purpose
Number Of Circuits
1
-3db Bandwidth
900kHz
Current - Input Bias
30pA
Voltage - Input Offset
30µV
Current - Supply
380µA
Voltage - Supply, Single/dual (±)
±2 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
No. Of Amplifiers
1
Bandwidth
900kHz
No. Of Pins
8
Operating Temperature Range
-40°C To +85°C
Peak Reflow Compatible (260 C)
No
Input Bias Current
0.15nA
Output Type
-
Current - Output / Channel
-
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
OP97FS
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
OP97FSREEL
Manufacturer:
RENESAS
Quantity:
2 571
Company:
Part Number:
OP97FSZ
Manufacturer:
ADI
Quantity:
4 950
Part Number:
OP97FSZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
OP97FSZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OP97
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Connections ............................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
REVISION HISTORY
3/09—Rev. F to Rev. G
Changes to Figure 20 and Figure 23 ............................................... 9
Changes to Figure 26 and Figure 27 ............................................. 10
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
11/07—Rev. E to Rev. F
Updated Format .................................................................. Universal
Changes to Ordering Guide .......................................................... 16
07/03—Rev. D to Rev. E
Deleted H-08A .................................................................... Universal
Deleted Q-8 ......................................................................... Universal
Deleted E-20A ..................................................................... Universal
Deleted Die Characteristics ............................................................. 4
Deleted Wafer Test Limits ............................................................... 4
Updated TPC 14 ............................................................................... 5
Updated Outline Dimensions ....................................................... 10
Electrical Characteristics ............................................................. 3
Thermal Resistance ...................................................................... 5
Rev. G | Page 2 of 16
Typical Performance Characteristics ..............................................6
Application Information ................................................................ 11
AC Performance ............................................................................. 12
Guarding and Shielding ................................................................. 13
Outline Dimensions ....................................................................... 15
01/02—Rev. C to Rev. D
Edits to Absolute Maximum Ratings .............................................. 3
Edits to Ordering Guide ................................................................... 3
Deleted DICE Characteristics .......................................................... 3
Deleted Wafer Test Limits ................................................................ 3
Edits to Applications Information ................................................... 7
ESD Caution...................................................................................5
Ordering Guide .......................................................................... 16