LMC660CN/NOPB National Semiconductor, LMC660CN/NOPB Datasheet - Page 9
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LMC660CN/NOPB
Manufacturer Part Number
LMC660CN/NOPB
Description
IC OP AMP QUAD CMOS 14-DIP
Manufacturer
National Semiconductor
Specifications of LMC660CN/NOPB
Amplifier Type
General Purpose
Number Of Circuits
4
Output Type
Rail-to-Rail
Slew Rate
1.1 V/µs
Gain Bandwidth Product
1.4MHz
Current - Input Bias
0.002pA
Voltage - Input Offset
1000µV
Current - Supply
1.5mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
4.75 V ~ 15.5 V, ±2.38 V ~ 7.75 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Bandwidth
1.4 MHz
Channel Separation
130
Common Mode Rejection Ratio
83
Current, Input Bias
0.002 pA
Current, Input Offset
0.001 pA
Current, Output
40 mA
Current, Supply
0.75 mA
Harmonic Distortion
0.01 %
Impedance, Thermal
101 °C/W
Number Of Amplifiers
Dual
Package Type
MDIP-8
Resistance, Input
1 Teraohms
Temperature, Operating, Range
0 to +70 °C
Voltage, Gain
2000 V/mV
Voltage, Input
4.75 to 15.5 V
Voltage, Noise
22 nV/sqrt Hz
Voltage, Offset
1 mV
Voltage, Output, High
14.63 V
Voltage, Output, Low
0.26 V
Voltage, Supply
5 V
Number Of Channels
4
Voltage Gain Db
126.02 dB
Common Mode Rejection Ratio (min)
63 dB
Input Offset Voltage
6 mV at 5 V
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V
Supply Current
2.7 mA at 5 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Other names
*LMC660CN
*LMC660CN/NOPB
LMC660
LMC660CN
*LMC660CN/NOPB
LMC660
LMC660CN
Application Hints
cause only 0.05 pA of leakage current, or perhaps a minor
(2:1) degradation of the amplifier’s performance. See Figure
6a,Figure 6b, Figure 6c for typical connections of guard rings
for standard op amp configurations. If both inputs are active
and at high impedance, the guard can be tied to ground and
still provide some protection; see Figure 6d.
FIGURE 5. Example, using the LMC660,
of Guard Ring in P.C. Board Layout
(Continued)
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The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an
insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
struction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See Figure
7.
FIGURE 6. Guard Ring Connections
(d) Howland Current Pump
(b) Non-Inverting Amplifier
(a) Inverting Amplifier
(c) Follower
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