AD8079AR-REEL Analog Devices Inc, AD8079AR-REEL Datasheet - Page 3

• Manufacturer Part Number: AD8079AR-REEL
• Description: IC AMP BUF DUAL LP LDIST 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8079AR-REEL

• Rohs Status: RoHS non-compliant
• Amplifier Type: Buffer
• Number Of Circuits: 2
• Slew Rate: 800 V/µs
• -3db Bandwidth: 260MHz
• Current - Input Bias: 3µA
• Voltage - Input Offset: 10000µV
• Current - Supply: 10mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/dual (±): 6 V ~ 12 V, ±3 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Output Type: -
• Gain Bandwidth Product: -

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit Duration
Storage Temperature Range . . . . . . . . . . . . . –65 C to +125 C
Operating Temperature Range (A Grade) . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 C
NOTES
1
2
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8079 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Specification is for device in free air:
8-Pin SOIC Package:
Small Outline Package (R) . . . . . . . . . . . . . . . . . . 0.9 Watts
. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Model
AD8079AR
AD8079AR-REEL
AD8079AR-REEL7
AD8079BR
AD8079BR-REEL
AD8079BR-REEL7
JA
= 160 C/Watt
2
1
Gain
G = +2.0
G = +2.0
G = +2.0
G = +2.2
G = +2.2
G = +2.2
ORDERING GUIDE
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
V
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8079 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately +150 C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175 C for an extended
period can result in device failure.
While the AD8079 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (+150 C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature
2.0
1.5
1.0
0.5
0
–50
Package
Description
8-Pin Plastic SOIC
REEL SOIC
REEL 7 SOIC
8-Pin Plastic SOIC
REEL SOIC
REEL 7 SOIC
–40 –30 –20 –10
AMBIENT TEMPERATURE – C
8-PIN SOIC PACKAGE
0
10 20
WARNING!
30 40
Package
Option
SO-8
SO-8
SO-8
SO-8
SO-8
SO-8
50 60 70
ESD SENSITIVE DEVICE
T
AD8079
J
= +150 C
80
90
9