MC33274ADG ON Semiconductor, MC33274ADG Datasheet

MC33274ADG

Manufacturer Part Number

MC33274ADG

Description

IC OPAMP QUAD HI SPEED 14SOIC

Manufacturer

ON Semiconductor

Datasheet

1.MC33272ADR2G.pdf (16 pages)

Specifications of MC33274ADG

Amplifier Type

General Purpose

Number Of Circuits

Slew Rate

10 V/µs

Gain Bandwidth Product

24MHz

Current - Input Bias

300nA

Voltage - Input Offset

100µV

Current - Supply

2.15mA

Current - Output / Channel

37mA

Voltage - Supply, Single/dual (±)

3 V ~ 36 V, ±1.5 V ~ 18 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

14-SOIC (3.9mm Width), 14-SOL

Number Of Channels

Common Mode Rejection Ratio (min)

80 dB

Input Voltage Range (max)

Positive Rail - 1.8 V

Input Voltage Range (min)

Negative Rail

Input Offset Voltage

2 mV

Input Bias Current (max)

650 nA

Operating Supply Voltage

36 V

Supply Current

8.6 mA

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Dual Supply Voltage

+/- 3 V, +/- 5 V, +/- 9 V

Maximum Dual Supply Voltage

+/- 18 V

Minimum Dual Supply Voltage

+/- 1.5 V

Mounting Style

SMD/SMT

Shutdown

Supply Voltage (max)

36 V

Supply Voltage (min)

3 V

Technology

Bipolar

Voltage Gain Db

100 dB

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Output Type

-3db Bandwidth

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

MC33274ADGOS

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MC33274ADG

Manufacturer:

ON Semiconductor

Quantity:

Company:

Meier Automation Equipment Co., Limited

Part Number:

MC33274ADG

Manufacturer:

ON/安森美

Quantity:

20 000

Current page: 1 of 16
Download datasheet (319Kb)

MC33272A, MC33274A,

NCV33272A, NCV33274A

Single Supply,

High Slew Rate,

Low Input Offset Voltage

Operational Amplifiers

quality fabricated with innovative Bipolar design concepts. This dual

and quad operational amplifier series incorporates Bipolar inputs

along with a patented Zip−R−Trim element for input offset voltage

reduction. The MC33272/74 series of operational amplifiers exhibits

low input offset voltage and high gain bandwidth product.

Dual−doublet frequency compensation is used to increase the slew rate

while maintaining low input noise characteristics. Its all NPN output

stage exhibits no deadband crossover distortion, large output voltage

swing, and an excellent phase and gain margin. It also provides a low

open loop high frequency output impedance with symmetrical source

and sink AC frequency performance.

Features

•

June, 2008 − Rev. 13

The MC33272/74 series of monolithic operational amplifiers are

±1.5 V to ±18 V

and Control Changes

Input Offset Voltage Trimmed to 100 mV (Typ)

Low Input Bias Current: 300 nA

Low Input Offset Current: 3.0 nA

High Input Resistance: 16 MW

Low Noise: 18 nV/

High Gain Bandwidth Product: 24 MHz @ 100 kHz

High Slew Rate: 10 V/ms

Power Bandwidth: 160 kHz

Excellent Frequency Stability

Unity Gain Stable: w/Capacitance Loads to 500 pF

Large Output Voltage Swing: +14.1 V/ −14.6 V

Low Total Harmonic Distortion: 0.003%

Power Supply Drain Current: 2.15 mA per Amplifier

Single or Split Supply Operation: +3.0 V to +36 V or

ESD Diodes Provide Added Protection to the Inputs

NCV Prefix for Automotive and Other Applications Requiring Site

Pb−Free Packages are Available

√

@ 1.0 kHz

See detailed ordering and shipping information in the package

dimensions section on page 11 of this data sheet.

x = A for MC33272AD/DR2

(Note: Microdot may be in either location)

= N for NCV33272ADR2

MC33274ADG

AWLYWW

ORDERING INFORMATION

WL, L

YY, Y

WW, W = Work Week

G or G

ALYWG

MC33

274A

http://onsemi.com

QUAD

DUAL

CASE 626

CASE 751

CASE 646

D SUFFIX

P SUFFIX

PDIP−14

SOIC−8

PDIP−8

= Assembly Location

= Wafer Lot

= Year

= Pb−Free Package

Publication Order Number:

CASE 751A

D SUFFIX

SOIC−14

DTB SUFFIX

CASE 948G

TSSOP−14

NCV33274ADG

AWLYWW

ALYWG

AWLYYWWG

NCV3

MC33274AP

3274

DIAGRAMS

MARKING

MC33272AP

MC33272A/D

ALYWx

YYWWG

33272

AWL

Related parts for MC33274ADG

MC33274ADG Summary of contents

Page 1

... PDIP−8 P SUFFIX CASE 626 8 1 SOIC− SUFFIX CASE 751 for MC33272AD/DR2 = N for NCV33272ADR2 QUAD PDIP−14 P SUFFIX CASE 646 MC33274ADG AWLYWW MC33 274A ALYWG Assembly Location WL Wafer Lot YY Year WW Work Week Pb−Free Package (Note: Microdot may be in either location) ...

Page 2

DUAL CASE 626/751 Output Inputs (Top View) MAXIMUM RATINGS Rating Supply Voltage Input Differential Voltage Range Input Voltage Range Output Short Circuit Duration (Note 2) Maximum Junction Temperature Storage Temperature ...

Page 3

DC ELECTRICAL CHARACTERISTICS Characteristics Input Offset Voltage ( + − +25° −40° to +85° ...

Page 4

AC ELECTRICAL CHARACTERISTICS Characteristics Slew Rate (V = − + 2.0 kW Gain Bandwidth Product (f = 100 kHz) AC Voltage Gain (R = 2.0 kW ...

Page 5

MC33272P & MC33274P 1600 MC33274D 1200 800 MC33272D 400 0 -60 -40 - 100 120 140 160 180 T , AMBIENT TEMPERATURE (°C) A Figure 2. Maximum Power Dissipation versus Temperature 400 350 ...

Page 6

T = 25° 5 SUPPLY VOLTAGE ( Figure 8. Split Supply Output Voltage Swing versus Supply Voltage 125°C ...

Page 7

T = 125°C A 100 +PSR = 20Log 100 1 FREQUENCY (Hz) Figure ...

Page 8

Gain 15 10 Phase 5 - 25°C A -20 -25 100 k 1 FREQUENCY ...

Page 9

Phase Margin 9 + - 25° ...

Page 10

+ - +1 2 100 pF L ...

Page 11

... ORDERING INFORMATION Device MC33272AD MC33272ADG MC33272ADR2 MC33272ADR2G MC33272AP MC33272APG NCV33272ADR2* NCV33272ADR2G* MC33274AD MC33274ADG MC33274ADR2 MC33274ADR2G MC33274ADTBR2G MC33274AP MC33274APG NCV33274AD* NCV33274ADG* NCV33274ADR2* NCV33274ADR2G* NCV33274ADTBR2G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 12

... G C SEATING PLANE −Z− 0.25 (0.010 0.024 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 13

−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 13 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...

Page 14

... IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) −T− G SEATING D PLANE 14X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. TSSOP−14 CASE 948G−01 ISSUE 0.25 (0.010 − ...

Page 15

... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...

Page 16

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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