MC34064D-5R2G ON Semiconductor, MC34064D-5R2G Datasheet
MC34064D-5R2G
Specifications of MC34064D-5R2G
MC34064D-5R2GOS
MC34064D-5R2GOSTR
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MC34064D-5R2G Summary of contents
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MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. ...
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MAXIMUM RATINGS Power Input Supply Voltage Reset Output Voltage Reset Output Sink Current (Note 2) Clamp Diode Forward Current, Reset to Input Pin (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ T A ...
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25°C A 8.0 6.0 4.0 2 2.0 4.0 6 INPUT VOLTAGE (V) in Figure 2. Reset Output Voltage versus Input Voltage 4.630 ...
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Figure 8. Clamp Diode Forward Current versus Voltage + Input Power Supply - Figure 9. Low Voltage Microprocessor Reset Input Power Supply - - + 1.2V ref ...
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Input Power Supply - - + 1.2V ref GND Figure 11. Voltage Monitor 14.5V + 470 22 + 4.7k 330 Input - + 1.2V ref GND Figure 13. Low Power Switching Regulator 4.6V Overheating ...
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... ORDERING INFORMATION Device Operating Temperature Range MC34064D−005 MC34064D−5G MC34064D−5R2 MC34064D−5R2G MC34064DM−5R2 MC34064DM−5R2G MC34064P−005 MC34064P−5G MC34064P−5RA MC34064P−5RAG MC34064P−5RP MC34064P−5RPG MC34064P−5RM MC34064P−5RMG MC34064SN−5T1 MC34064SN−5T1G MC33064D−005 MC33064D−5G MC33064D− ...
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ORDERING INFORMATION Device Operating Temperature Range NCV33064D−5R2* NCV33064D−5R2G* NCV33064P−5RA* NCV33064P−5RAG NCV33064P−5RP* NCV33064P−5RPG* NCV33064DM−5R2* NCV33064DM−5R2G* †For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 D SUFFIX CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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... SEATING −T− PLANE A 0.038 (0.0015) A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS Micro8 DM SUFFIX CASE 846A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...
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... A C SEATING 0.05 PLANE H T 0.039 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSOP−5 SN SUFFIX CASE 483−02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER 2. CONTROLLING DIMENSION: MILLIMETERS. ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...