CG75L Littelfuse Inc, CG75L Datasheet - Page 4

• Manufacturer Part Number: CG75L
• Description: SURGE ARRESTER GDT 75V AXIAL
• Manufacturer: Littelfuse Inc
• Series: CGr
• Type: ESDr

Specifications of CG75L

• Spark Over Voltage: 75V
• Impulse Discharge Current: 20kA 8x20µs
• Package / Case: Axial
• Mounting Type: Through Hole
• Peak Pulse Current: 20 A
• Dc Breakover Voltage (nominal): 75 V
• Number Of Electrodes: 2
• Termination Style: Axial
• Failsafe Protection Y/n: N
• Dimensions: 8.1 mm D x 6.07 mm L
• Mounting Style: Through Hole
• Technology: Gas Plasma Arrester
• Voltage Rating: 75 V
• Brand/series: CG Series
• Capacitance: 1 pF
• Current, Supply: 20 A
• Package: Leads
• Voltage, Breakdown: 90 V
• Voltage, Operating: 10 V
• Voltage, Reverse: 90 V
• Dc Breakover Voltage: 75V
• Impulse Sparkover Voltage: 400V
• Gdt Case Style: Axial Leaded
• Breakdown Voltage Min: 60V
• Breakdown Voltage Vbr: 75V
• Rohs Compliant: Yes
• Impulse Discharge Current, 10/8-20us: 20kA
• Breakdown Voltage: 90V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 420-1067; 420-1067; F2726

©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within °C of actual peak
Temperature (t
Ramp-down Rate
Time 2 °C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
300
280
260
240
220
200
180
160
140
120
100
S(max)
Time (Seconds)
80
60
40
20
L
0
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
p
)
Preheat Time
P
)
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
150°C
200°C
5°C/second max
217°C
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Cooling Time
°C
Revised: January 21, 2011
33
Recommended Process Parameters:
Preheat:
Solder Pot Temperature:
Solder Dwell Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
time to peak temperature
(t 25ºC to peak)
t
Preheat
S
100
150
2-5 seconds
Ramp-up
Lead-Free Recommendation
°
°
°
C
C
t
t
P
L
Time
Ramp-down
Critical Zone
CG/CG2 Series
T
L
to T
P