NCP803SN463T1G ON Semiconductor, NCP803SN463T1G Datasheet - Page 9

IC MPU RESET MONITOR 4.63V SOT23

NCP803SN463T1G

Manufacturer Part Number
NCP803SN463T1G
Description
IC MPU RESET MONITOR 4.63V SOT23
Manufacturer
ON Semiconductor
Type
Simple Reset/Power-On Resetr
Datasheets

Specifications of NCP803SN463T1G

Number Of Voltages Monitored
1
Output
Open Drain or Open Collector
Reset
Active Low
Reset Timeout
140 ms Minimum
Voltage - Threshold
4.63V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Monitored Voltage
1.2 V to 4.9 V
Undervoltage Threshold
4.63 V
Overvoltage Threshold
4.7 V
Manual Reset
No
Watchdog
No
Battery Backup Switching
No
Power-up Reset Delay (typ)
460 ms
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1 V
Supply Current (typ)
0.8 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 105 C
Chip Enable Signals
No
Internal Hysteresis
No
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 105 C
Output Type
Open Collector / Drain
Power Fail Detection
No
Number Of Elements
1
Monitored Voltage 1 (typ)
1.2 to 4.9V
Threshold Voltage 1 (max)
4.7V
Watchdog Timer
No
Reset Active Time
460ms
Package Type
SOT-23
Operating Supply Voltage (min)
1.2V
Operating Supply Voltage (max)
5.5V
Reset Threshold Voltage (max)
4.7V
Reset Threshold Voltage (min)
4.56V
Family Name
NCP803
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
3
Supply Current
0.0008mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NCP803SN463T1GOS
NCP803SN463T1GOS
NCP803SN463T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCP803SN463T1G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
NCP803SN463T1G
0
Company:
Part Number:
NCP803SN463T1G
Quantity:
2 500
A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
VIEW C
L1
http://onsemi.com
SOT−23 (TO236)
L
CASE 318−08
ISSUE AN
q
0.25
9
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
inches
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
2.0
DIM
mm
A1
H
L1
A
b
c
D
E
e
L
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.047
0.070
0.004
0.014
0.083
0.110
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX

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