MC34164P-3G ON Semiconductor, MC34164P-3G Datasheet - Page 10

• Manufacturer Part Number: MC34164P-3G
• Description: IC SENSOR UNDERVOLT 3V TO-226AA
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MC34164P-3G

• Number Of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Voltage - Threshold: 2.68V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: TO-92-3 (Standard Body), TO-226
• Number Of Voltage Supervisors: 1
• Monitored Supervisor Voltage: 3
• Reset Threshold Voltage (min): 2.55V
• Reset Threshold Voltage (max): 2.8V
• Operating Supply Voltage (min): 1V
• Operating Supply Voltage (max): 10V
• Power Dissipation: 700mW
• Package Type: TO-92
• Operating Temperature Classification: Commercial
• Operating Temp Range: 0C to 70C
• Pin Count: 3
• Mounting: Through Hole
• Monitored Voltage: 3 V
• Undervoltage Threshold: 2.71 V
• Overvoltage Threshold: 2.8 V
• Manual Reset: No
• Watchdog: No
• Battery Backup Switching: No
• Power-up Reset Delay (typ): Adj
• Supply Voltage (max): 10 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 24 uA
• Maximum Power Dissipation: 700 mW
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 70 C
• Chip Enable Signals: No
• Internal Hysteresis: Yes
• Minimum Operating Temperature: 0 C
• Operating Temperature Range: 0 C to + 70 C
• Output Type: Open Collector / Drain
• Power Fail Detection: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reset Timeout: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC34164P-003GOS; MC34164P-3GOS; MC34164P-3GOS

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
PACKAGE DIMENSIONS
1.0
C A B
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
TSOP−5
K
10
0.074
DETAIL Z
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_