CG2230 Littelfuse Inc, CG2230 Datasheet - Page 4
CG2230
Manufacturer Part Number
CG2230
Description
SURGE ARRESTER GDT 230V SMD
Manufacturer
Littelfuse Inc
Series
CG2r
Specifications of CG2230
Impulse Discharge Current
20kA 8x20µs
Spark Over Voltage
230V
Package / Case
Non-Standard SMD
Mounting Type
Surface Mount
Suppressor Type
Gas Discharge Tube (GDT)
Dc Breakover Voltage
230V
Impulse Sparkover Voltage
600V
Gdt Case Style
Axial Leaded
Breakdown Voltage Min
195V
Breakdown Voltage Vbr
230V
Rohs Compliant
Yes
Breakdown Voltage
265V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CG2230
Manufacturer:
LITTELFUSE
Quantity:
8 796
Company:
Part Number:
CG2230L
Manufacturer:
Littelfuse
Quantity:
4 150
Company:
Part Number:
CG2230LS
Manufacturer:
LITTELFUSE
Quantity:
8 833
Part Number:
CG2230LSTR
Manufacturer:
SRC
Quantity:
20 000
Part Number:
CG2230MS
Manufacturer:
SMD
Quantity:
20 000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within °C of actual peak
Temperature (t
Ramp-down Rate
Time 2 °C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
300
280
260
240
220
200
180
160
140
120
100
S(max)
Time (Seconds)
80
60
40
20
L
0
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
p
)
Preheat Time
P
)
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
150°C
200°C
5°C/second max
217°C
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Cooling Time
°C
Revised: January 21, 2011
33
Recommended Process Parameters:
Preheat:
Solder Pot Temperature:
Solder Dwell Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
time to peak temperature
(t 25ºC to peak)
t
Preheat
S
100
150
2-5 seconds
Ramp-up
Lead-Free Recommendation
°
°
°
C
C
t
t
P
L
Time
Ramp-down
Critical Zone
CG/CG2 Series
T
L
to T
P