CMF-SD25-2 Bourns Inc., CMF-SD25-2 Datasheet - Page 2

• Manufacturer Part Number: CMF-SD25-2
• Description: CPTC FUSE RESET .130A HOLD SMD
• Manufacturer: Bourns Inc.
• Series: CMF-SDr
• Type: Telecom CPTC Resettable Fusesr

Specifications of CMF-SD25-2

• Voltage - Max: 230V
• Time To Trip: 0.3s
• Current - Hold (ih) (max): 130mA
• Current - Trip (it): 260mA
• Current - Max: 2.8A
• Package / Case: Non-Standard SMD
• Hold Current: 0.13 Amp
• Trip Current: 0.26 Amp
• Current Rating (max): 2.8 Amps
• Resistance: 25 Ohms
• Maximum Voltage: 230 VoltsAC
• Termination Style: SMD/SMT
• Mounting Style: SMD/SMT
• Dimensions: 9 mm L x 10.8 mm W x 10.2 mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• R Min/max: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: CMF-SD25-2TR

Applications
Used as a secondary overcurrent protection
device in:
■
■
■
COPLANARITY:
(Reduced value available on request.)
Packaging Options - Tape and Reel:
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400
pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
Solder refl ow
•
•
•
•
•
Note:
•
Rework
•
DIMENSIONS:
H
Solder Refl ow Recommendations
Product Dimensions
Customer Premise Equipment (CPE)
Central Offi ce (CO)
Access equipment
Recommended refl ow methods: IR, vapor phase oven, hot air oven.
Devices are not designed to be wave soldered to the bottom side of the
board.
Gluing the devices is not recommended.
Recommended maximum paste thickness is 0.25 mm (.010 inch).
Devices can be cleaned using standard industry methods and solvents.
If refl ow temperatures exceed the recommended profi le, devices may not
meet the performance requirements.
A device should not be reworked.
300
250
200
150
100
50
CMF-SD Series - Telecom CPTC Resettable Fuses
0
F
A
(INCHES)
(.006)
0.15
MM
Preheating
160–220
B
G
Time (seconds)
D
E
C
Soldering
10–20
Dim.
G
A
B
C
D
E
H
F
Cooling
120
(.354)
10.80
(.425) MAX.
10.20
(.402)
(.020) MAX.
(.192 - .208)
(.095 - .103)
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
9.00
4.88 - 5.28
2.41 - 2.61
0.5
(.098)
(.039)
2.5
1.0
MAX.
MAX.
CMF-SD35A
CMF-SD50A
(.281) MAX.
(.355)
(.319)
(.020) MAX.
(.128 - .144)
(.095 - .103)
7.15
8.50
8.10
3.25 - 3.65
2.41 - 2.61
0.5
Customers should verify actual device performance in their specifi c applications.
(.098)
(.039)
2.5
1.0
MAX.
MAX.
Recommended Pad Layout
A
Dim.
Specifi cations are subject to change without notice.
1
3
A
B
C
D
G
H
E
F
1
3
CMF-SD SERIES, REV. O, 05/10
DIMENSIONS:
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
(.394)
(.346)
(.126)
(.079)
(.102)
(.197)
(.299)
(.394)
10.0
8.80
3.20
2.00
2.60
5.00
7.60
10.0
B
H
C
2
4
(INCHES)
MM
CMF-SD35A
CMF-SD50A
D
(.315)
(.278)
(.108)
(.079)
(.099)
(.136)
(.234)
(.321)
8.00
7.05
2.75
2.00
2.51
3.45
5.95
8.15
E
F
2
4
G