0603L035YR Littelfuse Inc, 0603L035YR Datasheet - Page 3

• Manufacturer Part Number: 0603L035YR
• Description: PTC RESETTABLE 6V .35A SMD 0603
• Manufacturer: Littelfuse Inc
• Series: POLYFUSE® 0603Lr

Specifications of 0603L035YR

• Package / Case: 0603 (1608 Metric)
• R Min/max: 0.200 ~ 1.000 Ohm
• Voltage - Max: 6V
• Time To Trip: 0.1s
• Current - Hold (ih) (max): 350mA
• Current - Trip (it): 750mA
• Current - Max: 40A
• Hold Current: 0.35 Amp
• Trip Current: 0.75 Amp
• Current Rating (max): 40 Amps
• Resistance: 1 Ohms
• Maximum Voltage: 6 VoltsDC
• Termination Style: SMD/SMT
• Mounting Style: SMD/SMT
• Holding Current: 350mA
• Tripping Current: 750mA
• Initial Resistance Max: 1ohm
• Operating Voltage: 6VDC
• Ptc Fuse Case: 0603
• External Depth: 1.55mm
• Initial Resistance Min: 0.2ohm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 0603L035; F2903TR

© 2010 Littelfuse, Inc
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0603L.html for current information.
Terminal Material
Lead Solderability
Soldering Parameters
Profile Feature
Average Ramp-Up Rate (T
Pre Heat:
Time Maintained
Above:
Peak / Classification Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Physical Specifications
p
)
Temperature Min (T
Temperature Max (T
Time (Min to Max) (t
Temperature (T
Temperature (t
Solder-Plated Copper
(Solder Material: Matte Tin (Sn))
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3.
S(max)
to T
L
L
)
)
P
P
)
)
P
s(min)
s(max)
)
s
)
)
)
Pb-Free Assembly
3°C/second max
150°C
200°C
60 – 180 secs
217°C
60 – 150 seconds
260
20 – 40 seconds
6°C/second max
8 minutes Max.
Surface Mount > 0603L Series
+0/-5
POLYFUSE
°C
Revised: July 12, 2010
®
17
Resettable PTCs
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
Moisture Sensitivity Level
Environmental Specifications
performance requirements
lead
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+10% typical resistance change
+85°C, 85% R.H.,100 hours
-/+15% typical resistance change
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215
No change
MIL–STD–883C, Method 2007 .1,
Condition A
No change
Level 1, J–STD–020C
2
environment for
0603L Series