MC33064D-5G ON Semiconductor, MC33064D-5G Datasheet - Page 8
![no-image](/images/manufacturer_photos/0/4/495/on_semiconductor_sml.jpg)
MC33064D-5G
Manufacturer Part Number
MC33064D-5G
Description
IC SENSING CIRCUIT 5V UV 8-SOIC
Manufacturer
ON Semiconductor
Type
Simple Reset/Power-On Resetr
Specifications of MC33064D-5G
Number Of Voltages Monitored
1
Output
Open Drain or Open Collector
Reset
Active Low
Voltage - Threshold
4.6V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Monitored Voltage
4.6 V
Undervoltage Threshold
4.61 V
Overvoltage Threshold
4.7 V
Manual Reset
No
Watchdog
No
Power-up Reset Delay (typ)
Adj
Supply Voltage (max)
6.5 V
Supply Voltage (min)
1 V
Supply Current (typ)
390 uA
Maximum Power Dissipation
625 mW
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 85 C
Internal Hysteresis
Yes
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Output Type
Open Collector / Drain
Voltage Supervisor Type
Voltage Detector
Number Of Voltage Supervisors
1
Monitored Supervisor Voltage
4.61
Reset Threshold Voltage (min)
4.5V
Reset Threshold Voltage (max)
4.7V
Operating Supply Voltage (min)
1V
Operating Supply Voltage (max)
6.5V
Power Dissipation
625mW
Package Type
SOIC N
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 85C
Pin Count
8
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reset Timeout
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33064D-5G
MC33064D-5GOS
MC33064D-5GOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC33064D-5G
Manufacturer:
ON Semiconductor
Quantity:
1
Part Number:
MC33064D-5G
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
Y
S
*For additional information on our Pb−Free strategy and soldering
C
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.25 (0.010)
X
SEATING
PLANE
S
0.10 (0.004)
0.024
0.6
M
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
M
N
http://onsemi.com
X 45
CASE 751−07
_
D SUFFIX
ISSUE AJ
M
SOIC−8
8
K
SCALE 6:1
0.060
0.155
1.52
4.0
J
1.270
0.050
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
G
M
A
B
C
D
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0.050 BSC
0
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_