LT1121CN8-3.3#PBF Linear Technology, LT1121CN8-3.3#PBF Datasheet - Page 9

• Manufacturer Part Number: LT1121CN8-3.3#PBF
• Description: IC REG LDO 3.3V 150MA 8-DIP
• Manufacturer: Linear Technology

Specifications of LT1121CN8-3.3#PBF

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: 4.17 ~ 30 V
• Voltage - Dropout (typical): 0.42V @ 150mA
• Number Of Regulators: 1
• Current - Output: 150mA
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Primary Input Voltage: 20V
• Output Voltage Fixed: 3.3V
• Dropout Voltage Vdo: 400mV
• No. Of Pins: 8
• Output Current: 150mA
• Voltage Regulator Case Style: DIP
• Operating Temperature Range: 0°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

APPLICATIO S I FOR ATIO
The LT1121 is a micropower low dropout regulator with
shutdown, capable of supplying up to 150mA of output
current at a dropout voltage of 0.4V. The device operates
with very low quiescent current (30µA). In shutdown the
quiescent current drops to only 16µA. In addition to the
low quiescent current the LT1121 incorporates several
protection features which make it ideal for use in battery-
powered systems. The device is protected against both
reverse input voltages and reverse output voltages. In
battery backup applications where the output can be held
up by a backup battery when the input is pulled to ground,
the LT1121 acts like it has a diode in series with its output
and prevents reverse current flow.
Adjustable Operation
The adjustable version of the LT1121 has an output
voltage range of 3.75V to 20V. The output voltage is set by
the ratio of two external resistors as shown in Figure 1. The
device servos the output voltage to maintain the voltage at
the adjust pin at 3.75V. The current in R1 is then equal to
3.75V/R1. The current in R2 is equal to the sum of the
current in R1 and the adjust pin bias current. The adjust pin
bias current, 150nA at 25°C, flows through R2 into the
adjust pin. The output voltage can be calculated according
to the formula in Figure 1. The value of R1 should be less
than 400k to minimize errors in the output voltage caused
by the adjust pin bias current. Note that in shutdown the
output is turned off and the divider current will be zero.
Curves of Adjust Pin Voltage vs Temperature and Adjust
Pin Bias Current vs Temperature appear in the Typical
Performance Characteristics. The reference voltage at the
adjust pin has a slight positive temperature coefficient of
V
V
I
OUTPUT RANGE = 3.75V
ADJ
OUT
ADJ
= 150nA
= 3.75V
= 3.75V 1 +
Figure 1. Adjustable Operation
IN
SHDN
U
(
AT
LT1121
25°C
GND
R2
R1
)
U
+ I
(
OUT
ADJ
ADJ
TO
30V
• R2
)
R1
W
R2
+
1121 • F01
V
OUT
U
approximately 15ppm/°C. The adjust pin bias current has
a negative temperature coefficient. These effects are small
and will tend to cancel each other.
The adjustable device is specified with the adjust pin tied
to the output pin. This sets the output voltage to 3.75V.
Specifications for output voltage greater than 3.75V will be
proportional to the ratio of the desired output voltage to
3.75V (V
output current change of 1mA to 150mA is –12mV typical
at V
Thermal Considerations
Power handling capability will be limited by maximum
rated junction temperature (125°C). Power dissipated by
the device will be made up of two components:
1. Output current multiplied by the input/output voltage
2. Ground pin current multiplied by the input voltage:
The ground pin current can be found by examining the
Ground Pin Current curves in the Typical Performance
Characteristics. Power dissipation will be equal to the sum
of the two components listed above.
The LT1121 series regulators have internal thermal limit-
ing designed to protect the device during overload condi-
tions. For continuous normal load conditions the maxi-
mum junction temperature rating of 125°C must not be
exceeded. It is important to give careful consideration to
all sources of thermal resistance from junction to ambient.
Additional heat sources mounted nearby must also be
considered.
Heat sinking, for surface mount devices, is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through holes can also be used to spread the heat gener-
ated by power devices. Tables 1 through 5 list thermal
resistances for each package. Measured values of thermal
resistance for several different board sizes and copper
areas are listed for each package. All measurements were
⎛
⎜
⎝
OUT
differential: I
I
3 75
GND
12
.
LT1121/LT1121-3.3/LT1121-5
= 3.75V. At V
V
OUT
• V
V
⎞
⎟
⎠
IN
/3.75V). For example: load regulation for an
• –
.
(
12
OUT
mV
OUT
• (V
)
=
= 12V, load regulation would be:
IN
(
–
– V
38
mV
OUT
), and
)
1121fc
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