LM2931M-5.0/NOPB National Semiconductor, LM2931M-5.0/NOPB Datasheet - Page 6

• Manufacturer Part Number: LM2931M-5.0/NOPB
• Description: IC REGULATOR LDO 5V 8-SOIC
• Manufacturer: National Semiconductor

Specifications of LM2931M-5.0/NOPB

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 26V
• Voltage - Dropout (typical): 0.3V @ 100mA
• Number Of Regulators: 1
• Current - Output: 100mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Other names: *LM2931M-5.0; *LM2931M-5.0/NOPB; LM2931M-5; LM2931M-5.0

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Output Voltage
Line Regulation
Load Regulation
Output Impedance
Output Noise Voltage
Long Term Stability
Ripple Rejection
Dropout Voltage
Maximum Operational Input
Voltage
Maximum Line Transient
Reverse Polarity Input Voltage,
DC
Reverse Polarity Input Voltage,
Transient
Electrical Characteristics for Fixed 5V Version
V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: All limits are guaranteed for T
Note 4: The maximum power dissipation is a function of maximum junction temperature T
maximum allowable power dissipation at any ambient temperature is P
150°C and the LM2931 will go into thermal shutdown. For the LM2931 in the TO-92 package, θ
TO-220 package, θ
with a heat sink, θ
interface.
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5
square inches of copper area, θ
W.
Note 5: Human body model, 100 pF discharged through 1.5 kΩ.
IN
= 14V, I
Quiescent Current
Parameter
O
= 10mA, T
JA
JA
is the sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
is 50°C/W; in the TO-263 package, θ
J
= 25°C, C2 = 100 μF (unless otherwise specified)
JA
is 50°C/W; with 1 square inch of copper area, θ
J
6.0V
−40°C
9V
6V
5 mA
100mA
100Hz -10kHz
I
−40°C
I
10Hz -100kHz, C
f
I
I
R
T = 1ms, τ
V
T = 1ms, τ
O
O
O
O
O
= 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold type face).
O
L
≤
= 100mA, V
= 120 Hz
= 10mA
= 100mA
= 500Ω, V
≤
≤
≥
10mA, 6V
≤
V
V
−0.3V, R
≤
≤
≤
IN
IN
DC
V
I
O
IN
T
T
≤
≤
and 10mA
J
J
≤
≤
≤
≤
16V
26V
≤
≤
100mA
100ms
100ms, R
O
26V, I
125°C
125°C
IN
L
Conditions
≤
≤
= 500Ω
JA
= 14V, T
OUT
5.5V,
V
is 73°C/W; and in the 6-Bump micro SMD package θ
IN
O
rms
= 100mA
≤
= 100μF
L
,
26V
= 500Ω
J
D
= 25°C
= (T
Jmax
6
− T
JA
is 37°C/W; and with 1.6 or more square inches of copper area, θ
A
)/θ
JA
Jmax
. If this dissipation is exceeded, the die temperature will rise above
(Note
, total thermal resistance θ
JA
0.05
Typ
−30
−80
200
500
0.4
0.3
LM2931A-5.0
14
15
20
80
33
70
5
2
4
is 195°C/W; in the SO-8 package, θ
2)
(Note
Limit
5.19
4.81
5.25
4.75
−15
−50
1.0
0.2
0.6
10
30
50
30
55
26
60
5
JA
3)
is 290°C/W. If the TO-220 package is used
JA
, and ambient temperature T
0.05
Typ
200
500
−30
−80
0.4
0.3
14
15
20
80
33
70
5
2
4
LM2931-5.0
JA
(Note
is 160°C/W, and in the
Limit
5.25
4.75
−15
−50
5.5
4.5
1.0
0.2
0.6
10
30
50
26
50
3)
JA
mV/1000
A
mV
mV
mA
mA
is 32°C/
mA
. The
Units
dB
μV
V
V
V
V
V
V
V
V
V
mΩ
MAX
MAX
hr
MAX
MIN
MIN
MIN
MIN
MIN
MIN
MAX
MAX
MAX
MAX
MIN
rms
MIN