MCP1703T-3002E/CB Microchip Technology, MCP1703T-3002E/CB Datasheet - Page 13
![IC REG LDO 3V 250MA SOT-23A](/photos/12/58/125843/mfg_mcp1703_sot-23a_sml.jpg)
MCP1703T-3002E/CB
Manufacturer Part Number
MCP1703T-3002E/CB
Description
IC REG LDO 3V 250MA SOT-23A
Manufacturer
Microchip Technology
Specifications of MCP1703T-3002E/CB
Package / Case
SOT-23A-3
Regulator Topology
Positive Fixed
Voltage - Output
3V
Voltage - Input
Up to 16V
Voltage - Dropout (typical)
0.625V @ 250mA
Number Of Regulators
1
Current - Output
250mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
16 V
Output Voltage
3 V
Output Type
Fixed
Dropout Voltage (max)
0.65 V at 250 mA
Output Current
250 mA
Line Regulation
0.1 % / V
Load Regulation
1 %
Voltage Regulation Accuracy
2 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MCP1703T-3002E/CBTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1703T-3002E/CB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
6.0
6.1
The MCP1703 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1703 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
The
temperature specified for the MCP1703 is +125
estimate the internal junction temperature of the
MCP1703, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (Rθ
ambient for the SOT-23A pin package is estimated at
336
© 2007 Microchip Technology Inc.
I
50 mA
P
V
V
OUT
Input Voltage Range = 2.7V to 4.8V
LDO
IN(MAX)
OUT(MIN)
°
P
V
1.8V
C/W.
LDO
OUT
maximum
= LDO Pass device internal power dissipation
APPLICATION CIRCUITS &
ISSUES
Typical Application
Power Calculations
Package Type = SOT-23A
V
=
= Maximum input voltage
IN
APPLICATION INPUT CONDITIONS
V
POWER DISSIPATION
IN
JA
= LDO minimum output voltage
(
OUT
). The following equation can be used to
V
). The thermal resistance from junction to
maximum = 4.8V
IN MAX )
C
1 µF Ceramic
(
OUT
typical = 1.8V
Typical Application Circuit.
GND
V
I
continuous
OUT
OUT
MCP1703
)
–
= 50 mA maximum
V
OUT MIN
(
V
IN
operating
)
) I
V
2.7V to 4.8V
×
IN
1 µF Ceramic
OUT MAX )
C
IN
(
junction
°
C
)
.
To
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
EQUATION 6-5:
Where:
Where:
Where:
Where:
P
T
T
T
T
T
P
P
D(MAX)
T
A(MAX)
J(RISE)
J(RISE)
J(MAX)
J(MAX)
TOTAL
TOTAL
AMAX
Rθ
Rθ
Rθ
T
T
JA
JA
JA
A
J
T
J MAX
P
(
= Maximum continuous junction
= Total device power dissipation
= Thermal resistance from junction-
= Maximum ambient temperature
D MAX
= Maximum device power dissipation
= Maximum continuous junction
= Maximum ambient temperature
= Thermal resistance from junction-
= Rise in device junction temperature
= Maximum device power dissipation
= Thermal resistance from junction to
= Junction Temperature
= Rise in device junction temperature
= Ambient temperature
T
(
J RISE
(
temperature
to-ambient
temperature
to-ambient
over the ambient temperature
ambient
over the ambient temperature
)
T
=
)
J
=
P
)
=
TOTAL
=
(
---------------------------------------------------
T
T
J RISE
P
J MAX
(
(
D MAX
(
×
MCP1703
Rθ
Rθ
)
)
+
–
)
JA
JA
×
T
T
A
A MAX
Rθ
+
(
DS22049A-page 13
T
JA
AMAX
)
)