UPC2925BHB-AZ Renesas Electronics America, UPC2925BHB-AZ Datasheet - Page 17

• Manufacturer Part Number: UPC2925BHB-AZ
• Description: IC REG LDO 1A SC-64
• Manufacturer: Renesas Electronics America

Specifications of UPC2925BHB-AZ

• Regulator Topology: Positive Fixed
• Voltage - Output: 2.5V
• Voltage - Input: 3.5 ~ 12 V
• Voltage - Dropout (typical): 0.7V @ 1A
• Number Of Regulators: 1
• Current - Output: 1A (Max)
• Current - Limit (min): 1A
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

<R>
RECOMMENDED MOUNTING CONDITIONS
representative.
Surface Mount Device
μ
μ
μ
μ
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device
Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Infrared Ray Reflow
Vapor Phase Soldering
Partial Heating Method
Infrared Ray Reflow
Partial Heating Method
PC29xxBT Series: SC-63 (MP-3Z)
PC29xxBT1D Series: TO-252 (MP-3ZK)
PC29xxBT-AZ Series
PC29xxBT1D-AT Series
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
3. Pb-free (This product does not contain Pb in the external electrode and other parts.)
PC29xxB Series should be soldered and mounted under the following recommended conditions.
Process
Process
will be damaged by heat stress.
Note1
Note3
Peak temperature: 260 ° C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220 ° C or higher),
Maximum number of reflow processes: 3 times or less.
Peak temperature: 215 ° C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 ° C or higher),
Maximum number of reflow processes: 3 times or less.
Pin temperature: 350 ° C or below,
Heat time: 3 seconds or less (Per each side of the device).
Peak temperature: 260 ° C or below (package surface temperature),
Reflow time: 60 seconds or less (at 220 ° C or higher),
Maximum number of reflows processes: 3 times or less.
Pin temperature: 350 ° C or below,
Heat time: 3 seconds or less (per each side of the device).
,
μ
: TO-252 (MP-3ZK)
PC29xxBT-AY Series
Data Sheet G17567EJ4V0DS
Note2
: SC-63 (MP-3Z)
Conditions
Conditions
μ
PC29xxB Series
VP15-00-3
IR60-00-3
IR60-00-3
Symbol
Symbol
P350
P350
15