NCP693HMN33TCG ON Semiconductor, NCP693HMN33TCG Datasheet - Page 12

IC REG LDO 1A 3.3V CMOS 6-UDFN

NCP693HMN33TCG

Manufacturer Part Number
NCP693HMN33TCG
Description
IC REG LDO 1A 3.3V CMOS 6-UDFN
Manufacturer
ON Semiconductor
Datasheet

Specifications of NCP693HMN33TCG

Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 6.5V
Voltage - Dropout (typical)
0.43V @ 1A
Number Of Regulators
1
Current - Output
1A
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
6-USDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCP693HMN33TCG
Manufacturer:
ON Semiconductor
Quantity:
3 000
PUBLICATION ORDERING INFORMATION
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
NOTE 4
2X
LOCATION
DETAIL A
PIN ONE
0.05 C
0.05 C
0.10 C
0.10 C
K
b1
Í Í Í
Í Í Í
Í Í Í
e
BOTTOM VIEW
DETAIL B
6
SIDE VIEW
TOP VIEW
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
3
4
A1
A3
5X
2X
b
6X
A
B
E
0.10 C
0.05 C
E2
L
A
C
A
NOTE 3
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
SEATING
PLANE
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
B
L1
UDFN6, 1.8x2, 0.5P
http://onsemi.com
CASE 517BA−01
EXPOSED Cu
ISSUE A
CONSTRUCTIONS
CONSTRUCTIONS
*For additional information on our Pb−Free strategy and soldering
12
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DETAIL B
DETAIL A
OPTIONAL
Ç Ç É É
É É
OPTIONAL
L
5X
6X
MOLD CMPD
0.25
0.48
0.35
MOUNTING FOOTPRINT*
1
L
RECOMMENDED
1.70
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
DIMENSIONS: MILLIMETERS
Y14.5M, 1994.
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
THE TERMINAL TIP.
WELL AS THE TERMINALS.
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
A1
A3
b1
D2
E2
L1
A
D
K
b
E
e
L
MILLIMETERS
0.50
0.00
0.15
0.20
1.50
0.90
0.20
0.15
0.50
PITCH
MIN
---
0.20 REF
0.50 BSC
1.80 BSC
2.00 BSC
1.10
MAX
0.60
0.05
0.30
0.40
1.70
1.10
0.35
0.10
---
2.30
NCP693/D

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