MAX15006BATT/V+T Maxim Integrated Products, MAX15006BATT/V+T Datasheet - Page 2

• Manufacturer Part Number: MAX15006BATT/V+T
• Description: IC REG LINEAR 40V 6TDFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX15006BATT/V+T

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 40V
• Voltage - Dropout (typical): 0.3V @ 50mA
• Number Of Regulators: 1
• Current - Output: 50mA (Min)
• Current - Limit (min): 80mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

40V, Ultra-Low Quiescent-Current
Linear Regulators in 6-Pin TDFN/8-Pin SO
ABSOLUTE MAXIMUM RATINGS
IN to GND ...............................................................-0.3V to +45V
EN to GND..............................................................-0.3V to +45V
OUT, FB to GND.....................................................-0.3V to +12V
OUT Short-Circuit Duration ........................................Continuous
Maximum Current Into Any Pin (except IN and OUT) ......±50mA
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
ELECTRICAL CHARACTERISTICS
(V
T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Input Voltage Range
Ground Current
Shutdown Supply Current
A
IN
TDFN (derate 23.8mW/°C above +70°C) ........................1904mW
SO (derate 23.3mW/°C above +70°C)..........................1860mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
= +25°C.) (Note 2)
_______________________________________________________________________________________
= 14V, I
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
OUT
= 1mA, C
IN
= 0.1μF, C
A
SYMBOL
= +70°C)
I
I
SHDN
GND
V
IN
OUT
JC
= 2.2μF, T
) ...............8.5°C/W
Regulator on,
measured at GND
Regulator off (MAX15007 only)
JA
) ...........42°C/W
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical specifications are at
CONDITIONS
I
I
I
I
I
(MAX15006A/B)
I
I
(MAX15007A/B)
I
I
I
I
I
I
I
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
SO
= 0A (MAX15006A/B)
= 0A (MAX15006C)
= 0A (MAX15007A/B)
= 0A (MAX15007C)
= 100μA
= 100μA (MAX15006C)
= 100μA
= 100μA (MAX15007C)
= 1mA (MAX15006A/B)
= 1mA (MAX15006C)
= 1mA (MAX15007A/B)
= 1mA (MAX15007C)
= 50mA (MAX15006)
= 50mA (MAX15007)
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
MIN
4
TYP
10.5
11.5
8.5
9.5
10
11
12
10
13
11
90
93
8
9
3
JC
) ..................7°C/W
JA
MAX
150
150
) ...........43°C/W
40
17
15
18
16
18
16
19
17
20
18
21
19
5
UNITS
μA
μA
V