LT4356HMS-1#TRPBF Linear Technology, LT4356HMS-1#TRPBF Datasheet - Page 22

IC OVERVOLT PROT REG 10-MSOP

LT4356HMS-1#TRPBF

Manufacturer Part Number
LT4356HMS-1#TRPBF
Description
IC OVERVOLT PROT REG 10-MSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LT4356HMS-1#TRPBF

Voltage - Working
4 ~ 80V
Voltage - Clamping
27V Adj
Technology
Mixed Technology
Number Of Circuits
1
Applications
Automotive
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Family Name
LT4356-1
Package Type
MSOP
Operating Supply Voltage (min)
4V
Operating Supply Voltage (max)
80V
Operating Temperature (min)
-40C
Operating Temperature (max)
125C
Operating Temperature Classification
Automotive
Product Depth (mm)
3mm
Product Height (mm)
0.86mm
Product Length (mm)
3mm
Mounting
Surface Mount
Pin Count
10
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Digital Ic Case Style
MSOP
No. Of Pins
10
Operating Temperature Range
-40°C To +125°C
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
LT4356HMS-1#TRPBFLT4356HMS-1
Manufacturer:
LT
Quantity:
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Company:
Part Number:
LT4356HMS-1#TRPBFLT4356HMS-1
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LT4356HMS-1#TRPBFLT4356HMS-1#PBF
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
LT4356HMS-1#TRPBF
Manufacturer:
LT/凌特
Quantity:
20 000
PACKAGE DESCRIPTION
LT4356-1/LT4356-2
22
3.60 ±0.05
TOP MARK
2.20 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
0.25 ± 0.05
1.70 ± 0.05
4.00 ±0.10
3.30 ±0.05
(2 SIDES)
2.50 REF
(Reference LTC DWG # 05-08-1695 Rev D)
0.50 BSC
12-Lead Plastic DFN (4mm × 3mm)
0.70 ±0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
DE/UE Package
PACKAGE OUTLINE
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
0.25 ± 0.05
6
7
R = 0.115
3.30 ±0.10
2.50 REF
TYP
0.50 BSC
12
1
0.40 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0806 REV D
4356fa

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