ADG467BRZ Analog Devices Inc, ADG467BRZ Datasheet - Page 3
![IC CHAN PROTECTOR OCTAL 18-SOIC](/photos/1/38/13836/505-18-soic_sml.jpg)
ADG467BRZ
Manufacturer Part Number
ADG467BRZ
Description
IC CHAN PROTECTOR OCTAL 18-SOIC
Manufacturer
Analog Devices Inc
Series
ADG467r
Datasheet
1.ADG467BRSZ.pdf
(10 pages)
Specifications of ADG467BRZ
Voltage - Clamping
±40V
Technology
Mixed Technology
Number Of Circuits
8
Applications
General Purpose
Package / Case
18-SOIC (7.5mm Width)
No. Of Channels
8
On State Resistance Max
95ohm
Supply Voltage Range
± 20V
Operating Temperature Range
-40°C To +85°C
Analog Switch Case Style
SOIC
No. Of Pins
18
Msl
MSL 1 - Unlimited
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Working
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADG467BRZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . . –65 C to +125 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Plastic DIP Package
SOIC Package
SSOP Package
NOTES
1
2
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at S or D will be clamped by the channel protector, see Circuit
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maxi-
mum rating may be applied at any one time.
Information section of the data sheet.
SOIC Package
DD
S
S
A
(Pulsed at 1 ms, 10% Duty Cycle Max)
Industrial (B Version) . . . . . . . . . . . . . . . . . –40 C to +85 C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
Lead Temperature, Soldering
, V
, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–35 V to +35 V
= +25 C unless otherwise noted)
JA
JA
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
to V
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 130 C/W
D
D
, Analog Input Overvoltage with Power ON
, Analog Input Overvoltage with Power OFF
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
Model
ADG466BN
ADG466BR
ADG466BRM
ADG467BR
ADG467BRS
Temperature Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
1
SS
– 20 V to V
2
2
DD
ORDERING GUIDE
+ 20 V
Package Description
8-Lead Plastic DIP
8-Lead Small Outline Package
8-Lead Micro Small Outline Package
18-Lead Small Outline Package
20-Lead Shrink Small Outline Package
–3–
V
V
V
V
SS
D1
D2
D3
1
2
3
4
and SOIC
DIP, SOIC
(Not to Scale)
8-Lead
ADG466
TOP VIEW
PIN CONFIGURATIONS
8
7
6
5
V
V
V
V
V
V
V
V
V
NC
D1
D2
D3
D4
D5
D6
D7
D8
SS
V
V
V
V
DD
S1
S2
S3
10
NC = NO CONNECT
1
2
3
4
5
6
7
8
9
(Not to Scale)
20-Lead
ADG467
TOP VIEW
SSOP
Package Options
N-8
SO-8
RM-8
R-18
RS-20
ADG466/ADG467
WARNING!
V
20
19
18
16
15
14
13
12
V
V
V
V
V
V
V
V
17
11
D1
D2
D3
D4
D5
D6
D7
D8
SS
NC
V
V
V
V
V
V
V
V
V
DD
S1
S2
S3
S4
S5
S6
S7
S8
1
2
3
4
5
6
7
8
9
(Not to Scale)
ESD SENSITIVE DEVICE
18-Lead
ADG467
TOP VIEW
SOIC
10
18
17
16
15
14
13
12
11
V
V
V
V
V
V
V
V
V
DD
S1
S2
S3
S4
S5
S6
S7
S8