MC33269DTRK ON Semiconductor, MC33269DTRK Datasheet - Page 11
![IC REG LDO 0.8A ADJOUT DPAK](/photos/5/30/53089/dpak_369c_sml.jpg)
MC33269DTRK
Manufacturer Part Number
MC33269DTRK
Description
IC REG LDO 0.8A ADJOUT DPAK
Manufacturer
ON Semiconductor
Datasheet
1.MC33269TG.pdf
(13 pages)
Specifications of MC33269DTRK
Regulator Topology
Positive Adjustable
Voltage - Output
1.35 ~ 10 V
Voltage - Input
Up to 20V
Voltage - Dropout (typical)
1.1V @ 800mA
Number Of Regulators
1
Current - Output
800mA
Current - Limit (min)
800mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TO-252-2, DPak (2 Leads + Tab), TO-252AA, SC-63
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC33269DTRKOSCT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC33269DTRK-012G
Manufacturer:
ON
Quantity:
12 600
Company:
Part Number:
MC33269DTRK-3.3
Manufacturer:
M
Quantity:
2 126
Part Number:
MC33269DTRK-3.3
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Company:
Part Number:
MC33269DTRK-3.3G
Manufacturer:
ON
Quantity:
20 000
Part Number:
MC33269DTRK-3.3G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33269DTRK-5.0
Manufacturer:
ON
Quantity:
80 000
Part Number:
MC33269DTRK-5.0
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33269DTRK-5.0G
Manufacturer:
ON
Quantity:
20 000
Part Number:
MC33269DTRK-5.0G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC33269DTRKG
Manufacturer:
ON/安森美
Quantity:
20 000
L3
L4
b2
e
1
b3
4
2
E
3
b
A
D
0.005 (0.13)
B
*For additional information on our Pb−Free strategy and soldering
DETAIL A
M
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
c
0.228
5.80
L2
A
GAUGE
PLANE
PACKAGE DIMENSIONS
ROTATED 90 CW
SOLDERING FOOTPRINT*
c2
DETAIL A
H
C
0.244
L
6.20
http://onsemi.com
L1
CASE 369C−01
DT SUFFIX
ISSUE D
5
DPAK
0.102
11
2.58
A1
H
0.118
3.00
0.063
1.60
C
SCALE 3:1
Z
SEATING
PLANE
0.243
6.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
5. DIMENSIONS D AND E ARE DETERMINED AT THE
6. DATUMS A AND B ARE DETERMINED AT DATUM
inches
mm
Y14.5M, 1994.
MENSIONS b3, L3 and Z.
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
OUTERMOST EXTREMES OF THE PLASTIC BODY.
PLANE H.
DIM
A1
b2
b3
c2
L1
L2
L3
L4
A
D
H
b
c
E
e
L
Z
0.086
0.000
0.025
0.030
0.180
0.018
0.018
0.235
0.250
0.370
0.055
0.035
0.155
MIN
0.090 BSC
0.020 BSC
−−−
0.108 REF
INCHES
0.094
0.005
0.035
0.045
0.215
0.024
0.024
0.245
0.265
0.410
0.070
0.050
0.040
MAX
−−−
MILLIMETERS
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
9.40
1.40
0.89
3.93
MIN
−−−
2.29 BSC
2.74 REF
0.51 BSC
10.41
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
1.78
1.27
1.01
−−−