LM2931AD2T-5.0 ON Semiconductor, LM2931AD2T-5.0 Datasheet - Page 3

• Manufacturer Part Number: LM2931AD2T-5.0
• Description: IC REG LDO 100MA 5V 3.8% D2PAK
• Manufacturer: ON Semiconductor

Specifications of LM2931AD2T-5.0

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 40V
• Voltage - Dropout (typical): 0.16V @ 100mA
• Number Of Regulators: 1
• Current - Output: 100mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-2, D⊃2Pak (2 leads + Tab), TO-263AB
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Limit (min): -

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.
2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
3. D
4. NCV rated devices are subjected to and meet the AECQ−100 quality standards.
MAXIMUM RATINGS
Input Voltage Continuous
Transient Input Voltage (t ≤ 100 ms)
Transient Reverse Polarity Input Voltage
Electrostatic Discharge Sensitivity (ESD)
Operating Ambient Temperature Range
Operating Die Junction Temperature
Storage Temperature Range
Human Body Model (HBM) Class 2, JESD22 A114−C
Machine Model (MM) Class A, JESD22 A115−A
Charged Device Model (CDM), JESD22 C101−C
Power Dissipation
Case 29 (TO−92 Type)
Case 221A, 314A, 314B and 314D (TO−220 Type)
Case 318H (SOT−223)
Case 369A (DPAK) (Note 1)
Case 751 (SOP−8) (Note 2)
Case 936 and 936A (D
variation versus pad size.
1.0% Duty Cycle, t ≤ 100 ms
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
2
A
A
A
A
A
A
PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.
= 25°C
= 25°C
= 25°C
= 25°C
= 25°C
= 25°C
2
PAK) (Note 3)
Rating
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3
Symbol
−V
R
R
R
R
R
R
R
R
R
R
R
R
V
T
P
P
P
P
P
P
T
T
V
qJA
qJC
qJA
qJC
qJA
qJC
qJA
qJC
qJA
qJC
qJA
qJC
I
−
−
−
stg
(t)
I
D
D
D
D
D
D
A
J
(t)
I
Internally Limited
Internally Limited
Internally Limited
Internally Limited
Internally Limited
Internally Limited
−40 to +125
−65 to +150
Value
−50−
2000
2000
+150
200
178
242
160
5.0
6.0
5.0
40
60
83
65
21
92
25
70
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Vdc
Vpk
Vpk
°C
°C
°C
W
W
W
W
W
W
V
V
V