SP721AP Littelfuse Inc, SP721AP Datasheet - Page 2

• Manufacturer Part Number: SP721AP
• Description: TVS ARRAY ESD 6 INPUT 8-DIP
• Manufacturer: Littelfuse Inc
• Series: SP721r

Specifications of SP721AP

• Package / Case: 8-DIP
• Voltage - Working: 30V
• Technology: Mixed Technology
• Number Of Circuits: 6
• Applications: General Purpose
• Current Rating: +/- 5 A
• Forward Voltage Drop: 2 V
• Operating Voltage: 2 V to 30 V
• Channels: 6 Channels
• Capacitance: 3 pF
• Operating Temperature Range: - 40 C to + 105 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: F2166

TVS Diode Arrays
SP721
Electronic Protection Array for ESD and Overvoltage Protection
Absolute Maximum Ratings
Continuous Supply Voltage, (V+) - (V-). . . . . . . . . . . . . . . . . . . . . . . . . +35V
Forward Peak Current, I IN to V CC , I IN to GND
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
ESD Capability
ESD capability is dependent on the application and defined test standard.The
evaluation results for various test standards and methods based on Figure 1
are shown in Table 1.
For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-circuit”
method of ESD testing, the V+ and V- pins have a return path to ground and
the SP721 ESD capability is typically greater than 15kV from 100pF through
1.5kΩ. By strict definition of MIL-STD-3015.7 using “pin-to-pin” device testing,
the ESD voltage capability is greater than 6kV. The MIL-STD-3015.7 results
were determined from AT&T ESD Test Lab measurements.
The HBM capability to the IEC 61000-4-2 standard is greater than 15kV
for air discharge (Level 4) and greater than 4kV for direct discharge
(Level 2). Dual pin capability (2 adjacent pins in parallel) is well in excess
of 8kV (Level 4).
For ESD testing of the SP721 to EIAJ IC121 Machine Model (MM) standard,
the results are typically better than 1kV from 200pF with no series resistance.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
(Refer to Figure 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2A, 100µs
1. θ JA is measured with the component mounted on an evaluation PC board in free air.
NOTES:
Operating Voltage Range,
V
Forward Voltage Drop
Input Leakage Current
Quiescent Supply Current
Equivalent SCR ON Threshold
Equivalent SCR ON Resistance
Input Capacitance
Input Switching Speed
2. In automotive and battery operated systems, the power supply lines should be externally protected for load dump and reverse battery. When the
3. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance”. These characteristics are given here
SUPPLY
IN to V-
IN to V+
V+ and V- Pins are connected to the same supply voltage source as the device or control line under protection, a current limiting resistor should
be connected in series between the external supply and the SP721 supply pins to limit reverse battery current to within the rated maximum
limits. Bypass capacitors of typically 0.01µF or larger from the V+ and V- Pins to ground are recommended.
for thumb-rule information to determine peak current and dissipation under EOS conditions.
= [(V+) - (V-)]
PARAMETER
T A = -40
o
C to 105
o
C, V IN = 0.5V CC , Unless Otherwise Specified
I
QUIESCENT
SYMBOL
V
V
V
SUPPLY
FWDL
FWDH
C
t
I
ON
IN
IN
w w w . l i t t e l f u s e . c o m
I
Note 3
V
IN
FWD
= 1A (Peak Pulse)
TEST CONDITIONS
/I
FWD
; Note 3
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Storage Temperature Range . . . . . . . . . . . . . . . . . . . . -65
Maximum Junction Temperature (Plastic Package) . . . .. . . . . . . . . . . . . . . . 150
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . . .. . . . . . . . . . . .300
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
(SOIC Lead Tips Only)
MIL-STD-3015.7 Modified HBM
IEC 61000-4-2
EIAJ IC121
STANDARD
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
SUPPLY
TABLE 1. ESD TEST CONDITIONS
H.V.
±V
MIN
D
-20
CHARGE
SWITCH
-
-
-
-
-
-
-
-
Standard HBM
HBM, Air Discharge
HBM, Direct Discharge
HBM, Direct Discharge,
Two Parallel Input Pins
Machine Model
MIL-STD-3015.7: R
IEC 1000-4-2: R
TYPE/MODE
R
2 to 30
1
TYP
1.1
50
2
2
5
1
3
2
1
C
50 to 100MΩ
D
R
1
1 to 10MΩ
D
MAX
DISCHARGE
+20
200
SWITCH
-
-
-
-
-
1.5kΩ 100pF 15kV
1.5kΩ 100pF
330Ω 150pF 15kV
330Ω 150pF
330Ω 150pF
0kΩ
R
-
-
D
DUT
IN
200pF
C
UNITS
D
nA
nA
pF
ns
Ω
V
V
V
V
θ JA (
o
±V
6kV
4kV
8kV
1kV
C to 150
235
D
o
C/W)
o
o
o
C
C
C
5