CRCW1210100RJNEA Vishay, CRCW1210100RJNEA Datasheet - Page 6
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CRCW1210100RJNEA
Manufacturer Part Number
CRCW1210100RJNEA
Description
RES 100 OHM 1/2W 5% 1210 SMD
Manufacturer
Vishay
Series
CRCWr
Type
Thick Filmr
Specifications of CRCW1210100RJNEA
Resistance
100Ohm
Temperature Coefficient
±200ppm/°C
Resistance (ohms)
100
Power (watts)
0.5W, 1/2W
Composition
Thick Film
Tolerance
±5%
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Height
0.022" (0.55mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
1210 (3225 Metric)
Resistance In Ohms
100
Case
1210 (3225 metric)
Power Rating(s)
1/2W
Tolerance (+ Or -)
5%
Mounting Style
Surface Mount
Operating Temp Range
-55C to 155C
Case Style
Molded
Military Standard
Not Required
Failure Rate
Not Required
Product Length (mm)
3.2mm
Product Depth (mm)
2.5mm
Product Height (mm)
0.55mm
Resistance Tolerance
± 5%
Power Rating
330mW
Resistor Element Material
Thick Film
Resistor Case Style
1210
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
541-100VTR
CRCW1210 200 100R 5% ET1 E3
CRCW1210 200 100R 5% ET1 E3
D/CRCW e3
Vishay
www.vishay.com
116
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
58 (Td)
14 (Na)
30 (Db)
30 (Db)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Damp heat, cyclic
Damp heat, cyclic
Rapid change of
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
Lead (Pb)-Free Thick Film, Rectangular Chip Resistors
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) °C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C; ≥ 90 % RH;
55 °C; ≥ 90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) °C
PROCEDURE
24 h; 5 cycles
U =
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) °C
1000 cycles
≤ 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
≤ U
; 60 s
;
x R
max.
;
thickfilmchip@vishay.com
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 Ω)
SIZE 0402 to 2512
PERMISSIBLE CHANGE (ΔR)
Good tinning (≥ 95 % covered)
Good tinning (≥ 95 % covered)
No flashover or breakdown
No visible damage
REQUIREMENTS
no visible damage
no visible damage
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
± 5 %
Document Number: 20035
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
Revision: 02-Dec-10
REQUIREMENTS
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
CHANGE (ΔR/R)
PERMISSIBLE
10 Ω to 1 MΩ
± 100 ppm/K,
± 1 %; ± 5 %
± 200 ppm/K
SIZE 0201