CN0805K25G EPCOS Inc, CN0805K25G Datasheet - Page 72

no-image

CN0805K25G

Manufacturer Part Number
CN0805K25G
Description
VARISTOR 25VRMS 0805 SMD
Manufacturer
EPCOS Inc
Series
CN Standardr
Datasheets

Specifications of CN0805K25G

Energy
0.30J
Varistor Voltage
39V
Current-surge
120A
Number Of Circuits
1
Maximum Ac Volts
25VAC
Maximum Dc Volts
31VDC
Package / Case
0805 (2012 Metric)
Technology
Metal Oxide
Capacitance Value
250pF
Clamping Current
1A
Clamping Voltage
67V
Ac Voltage Rating (max)
25VAC
Dc Voltage Rating (max)
31VDC
Operating Temp Range
-55C to 125C
Mounting
Surface Mount
Surge Current (max)
80A
Size Code
0805
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Product Height (mm)
1.4mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72510V 250K 62
B72510V0250K062
B72510V250K62

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CN0805K25G
Manufacturer:
TDK
Quantity:
60 000
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Test
Wettability
Leaching
resistance
Thermal shock
(solder shock)
Tests of resistance
to soldering heat
for SMDs
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
Solderability tests
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-20
Test conditions
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215
for 3
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Immersion
of leads in
60/40 SnPb
for 10 s at 260 C
0.3 s
5 C
Page 72 of 81
3 C
Test conditions
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245
for 3
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
0.3 s
5 C
5 C
Criteria/ test results
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
Change of varistor
voltage:
Change of varistor
voltage:
Change of
capacitance X7R:
15%
5%
5/+10%
5%

Related parts for CN0805K25G