PR2512FKF070R004L Yageo, PR2512FKF070R004L Datasheet - Page 5
PR2512FKF070R004L
Manufacturer Part Number
PR2512FKF070R004L
Description
RES 0.004 OHM 1W 1% 2512 SMD
Manufacturer
Yageo
Series
PRr
Type
Thin Film Chip Resistorsr
Datasheet
1.PR2512FKF070R003L.pdf
(6 pages)
Specifications of PR2512FKF070R004L
Resistance (ohms)
0.004
Power (watts)
1W
Composition
Thick Film
Features
Current Sense
Temperature Coefficient
±100ppm/°C
Tolerance
±1%
Size / Dimension
0.248" L x 0.126" W (6.30mm x 3.20mm)
Height
0.022" (0.55mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
2512 (6432 Metric)
Resistance In Ohms
0.004
Case
2512 (6432 metric)
Resistance
4 mOhms
Power Rating
1 Watt
Product
Thin Film Resistors SMD
Operating Temperature Range
- 55 C to + 155 C
Dimensions
3.2 mm W x 6.3 mm L x 0.55 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
311-0.004AGTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PR2512FKF070R004L
Manufacturer:
YAGEO
Quantity:
46 000
TESTS AND REQUIREMENTS
TEST
Life/
Endurance
High
Temperature
Exposure/
Endurance
at
category
temperature
Moisture
Resistance
Thermal
Shock
Short time
overload
Board Flex/
Bending
Solderability
- Leaching
- Resistance
- Wetting
to Soldering
Heat
upper
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
MIL-STD-202 Method 106G
MIL-STD-202G Method
107G
IEC 60115-1 4.13
IEC 60068-2-21
IPC/JEDEC J-STD-002B
test B
IPC/JEDEC J-STD-002B
test D
IEC 60068-2-58
Chip Resistor Surface Mount
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at 155±5 °C,unpowered
Each temperature / humidity cycle is defined at
8 hours (Method 106G), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, un-powered Parts mounted on
test-boards, without condensation on parts
Measurement at 24±2 hours after test
conclusion.
-55/+125 °C
Note: Number of cycles required is 300.
Devices
unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 sec at room
temperature
Chips mounted on a 90mm glass epoxy resin
PCB(FR4)
2 mm bending
Bending time:
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: Method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Leadfree solder, 260 °C, 30 seconds
immersion time
Condition B, no pre-heat of samples
Leadfree solder, 260±5 °C, 10±1seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
PR
SERIES
60±1
2512(RoHS Compliant)
seconds
REQUIREMENT
± (1.0 % + 0.0005Ω)
± (1.0 % + 0.0005Ω)
± ( 0.5% + 0.0005Ω)
± ( 1.0% + 0.0005Ω)
± (1.0 % + 0.0005Ω)
Well tinned (>95%
covered)
No visible damage
No visible damage
± ( 0.5% + 0.0005Ω)
No visible damage
± (1.0% + 0.0005Ω)
No visible damage
www.yageo.com
4
5