CN1210K40G EPCOS Inc, CN1210K40G Datasheet - Page 72
![VARISTOR 40VRMS 1210 SMD](/photos/1/41/14103/495-varistor_tvs_series_1210_sml.jpg)
CN1210K40G
Manufacturer Part Number
CN1210K40G
Description
VARISTOR 40VRMS 1210 SMD
Manufacturer
EPCOS Inc
Series
CN Standardr
Specifications of CN1210K40G
Energy
2.3J
Varistor Voltage
68V
Current-surge
400A
Number Of Circuits
1
Maximum Ac Volts
40VAC
Maximum Dc Volts
56VDC
Package / Case
1210 (3225 Metric)
Technology
Metal Oxide
Capacitance Value
500pF
Clamping Current
2.5A
Clamping Voltage
110V
Ac Voltage Rating (max)
40VAC
Dc Voltage Rating (max)
56VDC
Operating Temp Range
-55C to 125C
Mounting
Surface Mount
Surge Current (max)
250A
Size Code
1210
Product Length (mm)
3.2mm
Product Depth (mm)
2.5mm
Product Height (mm)
1.7mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72530V 400K 62
B72530V0400K062
B72530V400K62
B72530V0400K062
B72530V400K62
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Test
Wettability
Leaching
resistance
Thermal shock
(solder shock)
Tests of resistance
to soldering heat
for SMDs
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
Solderability tests
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-20
Test conditions
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215
for 3
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Immersion
of leads in
60/40 SnPb
for 10 s at 260 C
0.3 s
5 C
Page 72 of 81
3 C
Test conditions
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245
for 3
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
0.3 s
5 C
5 C
Criteria/ test results
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
Change of varistor
voltage:
Change of varistor
voltage:
Change of
capacitance X7R:
15%
5%
5/+10%
5%