CU4032K14G2 EPCOS Inc, CU4032K14G2 Datasheet - Page 26
![VARISTOR STD 14VRMS 4032 SMD](/photos/1/41/14173/cu4032_series_sml.jpg)
CU4032K14G2
Manufacturer Part Number
CU4032K14G2
Description
VARISTOR STD 14VRMS 4032 SMD
Manufacturer
EPCOS Inc
Series
CUr
Datasheet
1.CU3225K250G2.pdf
(35 pages)
Specifications of CU4032K14G2
Varistor Voltage
22V
Current-surge
250A
Number Of Circuits
1
Maximum Ac Volts
14VAC
Maximum Dc Volts
18VDC
Energy
0.90J
Package / Case
Non-Standard SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72660M 140K 72
B72660M0140K072
B72660M140K72
B72660M0140K072
B72660M140K72
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CU4032K14G2
Manufacturer:
TDK-EPCOS
Quantity:
20 000
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Test
Wettability
Leaching
resistance
Thermal shock
(solder shock)
Tests of resistance
to soldering heat
for SMDs
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
Solderability tests
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-20
Test conditions
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215
for 3
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Immersion
of leads in
60/40 SnPb
for 10 s at 260 C
0.3 s
5 C
Page 26 of 35
3 C
Test conditions
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245
for 3
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
0.3 s
5 C
5 C
Criteria/ test results
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
Change of varistor
voltage:
Change of varistor
voltage:
Change of
capacitance X7R:
15%
5%
5/+10%
5%