CU4032K75G2 EPCOS Inc, CU4032K75G2 Datasheet - Page 20

VARISTOR STD 75VRMS 4032 SMD

CU4032K75G2

Manufacturer Part Number
CU4032K75G2
Description
VARISTOR STD 75VRMS 4032 SMD
Manufacturer
EPCOS Inc
Series
CUr
Datasheet

Specifications of CU4032K75G2

Varistor Voltage
120V
Current-surge
1.2kA
Number Of Circuits
1
Maximum Ac Volts
75VAC
Maximum Dc Volts
100VDC
Energy
5.9J
Package / Case
Non-Standard SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72660M 750K 72
B72660M0750K072
B72660M750K72

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CU4032K75G2
Manufacturer:
TDK-EPCOS
Quantity:
20 000
Soldering directions
1
1.1
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
Terminations
Nickel barrier termination
Silver-palladium termination
Page 20 of 35

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