PDL-111 Panduit Corp, PDL-111 Datasheet - Page 33
PDL-111
Manufacturer Part Number
PDL-111
Description
LABEL S LAM DM POLY WHT 2X.38"
Manufacturer
Panduit Corp
Series
PAN-CODE™r
Type
Labelr
Datasheet
1.PDL-73.pdf
(204 pages)
Specifications of PDL-111
Label Type
Die-Cut
Label Size
2" x 0.38" (50.8mm x 9.7mm)
Color
White
For Use With/related Products
Dot-Matrix Printer
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Panduit offers high quality thermal transfer labels in a variety
of materials, sizes and styles.
Panduit Thermal Transfer Labels are used for a wide variety of identification purposes including wire marking,
bar code labeling, and shipment tracking. Label materials are available that provide weather and chemical
resistance and withstand temperature extremes and UV exposure. With a full range of sizes, there is a label
available for every application. The need for large inventories of custom preprinted labels and long lead times
is eliminated, providing an economical solution to all of your labeling needs.
All labels in this section are roll mounted on 3.00" (76.2 mm) cores.
PAN-CODE
Self-Laminating Thermal Transfer Labels
• These labels are used most commonly for marking wires,
Specialized Blank Thermal Transfer Labels
• Panduit offers labels in a variety of high performance
Heat Shrink Labels
• Durable, high quality permanent heat shrink markers for wire
• Available in white and yellow for wire diameters from 0.04" to
Thermal Transfer Ribbons
• Designed specifically for outstanding images in harsh
• Available in two types:
™
cables, test tubes and other cylindrical objects in applications
where a protective overlaminate is needed.
materials for a wide range of applications from labeling circuit
boards to asset management to wire identification. These
labels are designed for specific purposes and are available in
five materials to meet your application requirements.
and cable identification.
1.00".
environments on a wide spectrum of materials.
- Resin for harsh environments
- Wax for self-laminating labels, heat shrink labels and
general purpose labeling
Thermal Transfer Labels — Introduction
33
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