DF30FC-20DP-0.4V(82) Hirose Electric Co Ltd, DF30FC-20DP-0.4V(82) Datasheet - Page 9

• Manufacturer Part Number: DF30FC-20DP-0.4V(82)
• Description: CONN PLUG 20POS 0.4MM SMD GOLD
• Manufacturer: Hirose Electric Co Ltd
• Series: DF30r

Specifications of DF30FC-20DP-0.4V(82)

• Pitch: 0.016" (0.40mm)
• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 20
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Contact Finish: Gold
• Mated Stacking Heights: 0.9mm
• Height Above Board: 0.031" (0.80mm)
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: H3864TR

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BUsage Recommendations
1. Recommended temperature profile
2. Recommended manual soldering
3. Recommended screen thickness and
4. Board warpage
5. Cleaning conditions
6. Precautions
open area ratio (Pattern area ratio)
Manual soldering: 340 ± 10ç for 3 seconds
Thickness: 0.12 mm
Opening are ratio: DS side 100%, DP side 84%
Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points.
Refer to "Nylon Connector Use Handbook".
■ Due to the extremely small size of the connectors, handling it with bare hands should
■ Mating and un-mating of the connectors when not soldered on the boards is not
■ Mated connectors should not carry weight of the board by themselves.
■ When mating/un-mating do not twist or lift by the corners.
■ Exercise extreme caution when mating/ un-mating when the connector is mounted on a
■ Do NOT pull on the flexible substrate.
■ Slight discoloration on the insulating materials will not affect form, fit or function of the
be avoided. Follow the recommendations given on the proceeding pages.
recommended as this may cause deformation of the terminals, damage to the contacts
or insulators.
Provide some other support of the boards.
Apply the forces evenly across the entire length and width of the connectors taking
care NOT to damage or deform soldered terminations.
connectors.
non-rigid (flexible) substrate.
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
DF30 Series●0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
a return to normal temperature between the first and second cycle.
connector terminals.
(Temperature)
250ç
200ç
150ç
100ç
60 to 90 sec.
Preheating
240
220
10 to 20 sec.
Soldering
(Time)
A291