BM10B(0.8)-10DP-0.4V(51) Hirose Electric Co Ltd, BM10B(0.8)-10DP-0.4V(51) Datasheet - Page 9

• Manufacturer Part Number: BM10B(0.8)-10DP-0.4V(51)
• Description: CONN HDR 10POS 0.4MM SMD GOLD
• Manufacturer: Hirose Electric Co Ltd
• Series: BM10r

Specifications of BM10B(0.8)-10DP-0.4V(51)

• Pitch: 0.016" (0.40mm)
• Connector Type: Header, Outer Shroud Contacts
• Number Of Positions: 10
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Contact Finish Thickness: 2µin (0.05µm)
• Mated Stacking Heights: 0.8mm
• Height Above Board: 0.025" (0.63mm)
• Product Type: PCB
• Number Of Positions / Contacts: 10
• Mounting Angle: Vertical
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: H11811TR

[Reflow condition for Nickel barrier evaluation]
Temperature profile: Max 260 °C, Oxygen density: Max 1000 ppm (N
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Specifications herein are subject to change without notice.
Contact Hirose for latest specification, drawings, or availabilities.
Contact point
Receptacle
Solder Wicking Prevention
Nickel barrier prevents solder wicking.
plating
Gold
Nickel barrier
Contact
point
plating
Gold
Issued: Mar. 31, 2010
Header
ITS-P-08016NB_.2 (Page 9 of 15)
2
Nickel barrier
reflow)
Image: 0.8 mm stacking height
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