FX12B-40P-0.4SV Hirose Electric Co Ltd, FX12B-40P-0.4SV Datasheet - Page 7

• Manufacturer Part Number: FX12B-40P-0.4SV
• Description: CONN PLUG 40POS 0.4MM SMD SHIELD
• Manufacturer: Hirose Electric Co Ltd
• Series: FX12r

Specifications of FX12B-40P-0.4SV

• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Connector Type: Plug, Center Strip Contacts
• Number Of Positions: 40
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1.5mm
• Height Above Board: 0.053" (1.35mm)
• Product Type: Plugs
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Number Of Positions / Contacts: 40
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: H11407TR

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BRecommended solder temperature profile.
Note: The temperature profile indicates the maximum temperature
BCleaning recommendations
Organic solvent cleaning
Water based cleaning
When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation
issued by the various manufacturers of cleaning agents which describes it’s affects on metals, platings and plastics. Remove any
moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect electrical performance.
260
240
220
200
180
160
140
IPA (Isoporopyl alcohol)
HCFC (Hydrochlorofluorocarbon)
of the connector surfaces at the highest point from the PCB
mounting surface.
0
Solvent type
150ç
(90~120sec.)
200ç
(MAX 60sec.)
Room temperature cleaning
MAX 250ç
220ç
FX12 Series●0.4 mm Pitch, 1.5 mm Board-to-Board Connectors with Dual Shields
Time (Seconds)
YES
YES
< HRS test conditions >
Solder method
Environment
Solder paste
Test board
Metal mask
Reflow cycles
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may very,
depending on solder paste type, volume / thickness and
board size/ thickness. Cosult your solder paste and
equipment manufacture for specific recommendations.
Heated cleaning
YES
YES
:Reflow
:Room air
:96.5%Sn/3.0%Ag/0.5%Cu
:Glass epoxy 40mm∞30mm∞1mm
:0.12mm thick
:2cycles
thick
A269