DF12(3.0)-60DP-0.5V(86) Hirose Electric Co Ltd, DF12(3.0)-60DP-0.5V(86) Datasheet - Page 11
![CONN HEADER 60POS 3MM SMD 0.5MM](/photos/1/73/17354/df12_3_0_-60dp-0_5v_86__sml.jpg)
DF12(3.0)-60DP-0.5V(86)
Manufacturer Part Number
DF12(3.0)-60DP-0.5V(86)
Description
CONN HEADER 60POS 3MM SMD 0.5MM
Manufacturer
Hirose Electric Co Ltd
Series
DF12r
Datasheet
1.DF12-20DS-0.5V86.pdf
(11 pages)
Specifications of DF12(3.0)-60DP-0.5V(86)
Pitch
0.020" (0.50mm)
Number Of Rows
2
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
60
Mounting Type
Surface Mount
Features
Board Guide, Solder Retention
Contact Finish
Gold
Contact Finish Thickness
8µin (0.20µm)
Mated Stacking Heights
3mm
Height Above Board
0.091" (2.30mm)
Product Type
Headers
Stack Height
3 mm
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Number Of Positions / Contacts
60
Contact Material
Phosphor Copper
Contact Plating
Gold
Voltage Rating
50 V
Current Rating
0.3 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
H5224TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF12(3.0)-60DP-0.5V(86)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
7 000
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BPrecautions for Use
1.Recommended Temperature Profile (SMT)
2.Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 350 , Soldering time: Within 3 seconds
3.Recommended Screen Thickness and 0.12mm
4.Board Warp(SMT)
5.Cleaning Condition
6.Cautions
open area ratio(Pattern area ratio)
Note1: UP to 2 cycles of Reflow soldering are possible under the
Note2: The temperature profile indicates the board surface
Open area ratio: 70%
Maxmum 0.02mm in the connector center area, based on both connector edges
Refer to "Nylon Connector Use Hand book".
The receptacle is designed in a structure where contacts are exposed. Touching it with
bare hands would cause contact failure or electrostatic element damage.
Where no board is mounted, the insertion or extraction will cause damage or
contact deformation.
Avoid retaining the board with the connector only, and fix the board by any other means
than the connector.
Excessive scoop insertion or extraction may result in damage.
In the manual soldering process, don't carry out the flux coating which will cause a flux
blister on the connector.
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
same conditions, provided that there is a return to normal
temperature between the first and second cycle.
temperature at the point of contacts with the connector
terminals.
DF12 Series 0.5mm Pitch SMT Board to Board Connector
A203