QTE-040-02-L-D-A Samtec Inc, QTE-040-02-L-D-A Datasheet

QTE-040-02-L-D-A

Manufacturer Part Number

QTE-040-02-L-D-A

Description

CONN HEADER HI-SPEED DUAL 80POS

Manufacturer

Samtec Inc

Series

QStrip® QTEr

Datasheets

1.QTE-020-01-L-D-A.pdf (6 pages)

2.QTE-020-01-L-D-A.pdf (1 pages)

Specifications of QTE-040-02-L-D-A

Connector Type

Header, Outer Shroud Contacts

Number Of Positions

Pitch

0.031" (0.80mm)

Number Of Rows

Mounting Type

Surface Mount

Features

Board Guide, Ground Bus (Plane)

Contact Finish

Gold

Contact Finish Thickness

10µin (0.25µm)

Mated Stacking Heights

8mm

Height Above Board

0.286" (7.26mm)

Pitch Spacing

0.8mm

No. Of Contacts

Gender

Header

Contact Plating

Gold

Row Pitch

3.94mm

No. Of Rows

Contact Termination

Surface Mount Vertical

Contact Material

Phosphor Bronze

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

SAM8133

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QTE-040-02-L-D-A

Manufacturer:

Samtec Inc.

Quantity:

2 227

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QTE-040-02-L-D-A-FL

Manufacturer:

Samtec Inc.

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QTE-040-02-L-D-A-K

Manufacturer:

Samtec Inc.

Quantity:

21 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QTE-040-02-L-D-A-K-TR

Manufacturer:

Samtec Inc.

Quantity:

300

Company:

Meier Automation Equipment Co., Limited

Part Number:

QTE-040-02-L-D-A-K-TR

Manufacturer:

SAMTEC

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QTE-040-02-L-D-A-TR

Manufacturer:

Samtec Inc.

Quantity:

12 000

Current page: 1 of 1
Download datasheet (759Kb)

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?QTE

Insulator Material:

Liquid Crystal

Polymer

Terminal Material:

Phosphor Bronze

Plating:

Au or Sn over 50µ" (1,27µm) Ni

Current Rating:

Contacts: 1.3A @ 95°C

Ground Plane: 10.1A @ 95°C

Operating Temp Range:

-55°C to +125°C

Voltage Rating:

225 VAC mated with QSE

& 5mm Stack Height

Max Cycles: 100

Unmating Force (-RT1 option):

-RT1 option increases

unmating force up to 50%

RoHS Compliant:

Yes

Processing:

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (020-060)

(0,15mm) .006" max (080)

Board Stacking:

For applications requiring

more than two connectors

per board or 4 banks or more,

contact ipg@samtec.com

*Note: –C Plating passes

10 year MFG testing

Note: Some lengths, styles

and options are non-standard,

non-returnable.

HIGH SPEED GROUND PLANE HEADER

F-211

SPECIFIC OPTION

• 14mm, 15mm, 22mm

• 30µ" (0,76µm) Gold

• Edge Mount

• 100 positions per row

• Guide Posts, Screw Down

Call Samtec.

SPECIFICATIONS

(0,80mm) .0315"

QTE SERIES

and 30mm stack height

(Caution: Some automatic

placement/inspection

machines may have

component height

restrictions. Please

consult machinery

speciﬁ cations.)

(Specify -H plating for

Data Rate cable mating

applications.)

& Friction Lock

APPLICATION

Board Mates:

QSE

Cable Mates:

EQCD, EQSD,

EQDP, EQRF

(See Application

Speciﬁ c note)

.035 DIA

5mm Stack Height

Single-Ended Signaling

Differential Pair Signaling

Performance data for other stack heights and complete test data

available at www.samtec.com?QTE or contact sig@samtec.com

QTE

(5,97)

(0,89)

.235

Call Samtec for maximum cycles mated with QSE

–020, –040, –060, –080

–014, –028, –042, –056

(40 total pins per bank = –D)

(14 pairs per bank = –D–DP)

10 year Mixed Flowing Gas with 50µ" Gold

–D–DP = (No. of Positions per Row/14)

(0,76)

.030

(20,00) .7875

–D = (No. of Positions per Row/20)

EXTENDED LIFE PRODUCT

PINS PER ROW

NO. OF PAIRS

(3,30)

.130

x (20,00) .7875

(0,80)

.0315

Type

–DP

(1,57)

–D

.062

DIA

WWW.SAMTEC.COM

–RT1

Rated @ 3dB Insertion Loss

QTE–060–01–L–D–A

8.5 GHz / 17 Gbps

(1,57)

9 GHz / 18 Gbps

8 GHz / 16 Gbps

.062

(0,20)

.008

STYLE

Specify

STYLE

LEAD

Integral metal plane

for power or ground

chart

from

QTE–014–01–F–D–DP–A

(7,11)

.280

––L

10µ" (0,25µm) min Au

over 50µ" (1,27µm) Ni

(3,81µm) Ni on Signal

Pins in contact area,

(0,64)

Gold on Signal Pins

on Ground Plane in

Matte Tin over 50µ"

.025

Board Spacing Standoffs.

on Signal Pins and

(1,27µm) min Ni on

and Ground Plane,

= Electro-Polished

50µ" (1,27µm) min

Matte Tin on tails

= 10µ" (0,25µm)

Ground Plane,

Au over 150µ"

all solder tails

contact area,

PLATING

= Gold Flash

OPTION

AVAILABLE

Selective

–C*

See SO Series.

–F

–L

ALSO

Standard

stack heights

from 5mm

to 25mm

Polarized

STYLE

*Processing conditions

LEAD

QTE

–01

–02

–03

–04

–05

–07

will affect mated height.

TYPE

= Differential Pair

= Single-Ended

–D–DP

(–01 only)

–D

(10,27)

(15,25)

(18,26)

(24,24)

(4,27)

(7,26)

.168

.286

.404

.600

.718

.954

QTE–014–01–L–D–A–RT1

HEIGHT

(11,00)

(16,00)

(19,00)

(25,00)

WITH

QSE*

(5,00)

(8,00)

• E.L.P.

• Retention pin option

.197

.315

.433

.630

.748

.984

option (–C)

Polyimide Film

plating

= Tape & Reel

80 positions)

–RT1 option)

Pick & Place

(N/A on 56 &

80 positions

or –L (latch)

positions or

= Retention

OPTION

= (7,00mm)

(N/A on 42,

56, 60 & 80

Packaging

Style only)

= Latching

OTHER

.275" DIA

(-01 Lead

–RT1

–TR

option)

Option

–K

–L

Pad

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