CM6100 ON Semiconductor, CM6100 Datasheet - Page 4

• Manufacturer Part Number: CM6100
• Description: IC ASI PUSBOTG LOW CAP ESD 4CSP
• Manufacturer: ON Semiconductor

Specifications of CM6100

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Polarization: 2 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: 4-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

Mechanical Specification
CSP-4 Mechanical Specifications
The CM6100 is supplied in a 4 bump Chip Scale Package (CSP).
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Package
Bumps
0.755 0.800 0.845 0.0297 0.0315 0.0333
0.755 0.800 0.845 0.0297 0.0315 0.0333
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.150 0.200 0.250 0.0059 0.0079 0.0098
0.150 0.200 0.250 0.0059 0.0079 0.0098
0.570 0.600 0.630 0.0224 0.0236 0.0248
0.394 0.406 0.418 0.0155 0.0160 0.0165
Min
PACKAGE DIMENSIONS
Millimeters
Nom
Max
Custom CSP
Min
4
Inches
Nom
Rev. 6 | Page 4 of 6 | www.onsemi.com
Max
DIMENSIONS IN MILLIMETERS
0.27 DIA.
SOLDER BUMPS
CM6100 Chip Scale Package
B1
Controlling dimension: millimeters
Package Dimensions for
A
B
BOTTOM VIEW
2
A1
1
C1
D1
D2
CM6100
VIEW
SIDE