B72500D160H60 EPCOS Inc, B72500D160H60 Datasheet - Page 13

CERADIODE 16VDC 3PF 0603

B72500D160H60

Manufacturer Part Number
B72500D160H60
Description
CERADIODE 16VDC 3PF 0603
Manufacturer
EPCOS Inc
Series
CeraDioder
Datasheet

Specifications of B72500D160H60

Package / Case
0603 (1608 Metric)
Varistor Voltage
65V
Number Of Circuits
1
Maximum Dc Volts
16VDC
Polarity
Bidirectional
Clamping Voltage
290 V
Operating Voltage
16 V
Breakdown Voltage
65 V
Termination Style
SMD/SMT
Capacitance
3 pF
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Diode Type
ESD Protection
Clamping Voltage Vc Max
290V
Diode Case Style
0603
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Energy
-
Current-surge
-
Maximum Ac Volts
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-3420-2
495-3686-2
495-3686-2
B72500D 160H 60
B72500D0160H060
CDS3C16GTH

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B72500D160H60
Manufacturer:
EPCOS Inc
Quantity:
57 482
Part Number:
B72500D160H60
Manufacturer:
TDK-EPCOS
Quantity:
84 000
2
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020D.
3
3.1
The component is fixed onto the circuit board with cement prior to soldering. It must still be able
to move slightly. When the board is placed into the reflow oven, excessively rigid fixing can lead
to high forces acting on the component and thus to a break. In addition, too much cement can
lead to unsymmetrical stressing and thus to mechanical fracture of the component. The cement
must also be so soft during mounting that no mechanical stressing occurs.
3.2
It is best to mount the components on the board before soldering so that one termination does not
enter the oven first and the second termination is soldered subsequently. The ideal case is simul-
taneous wetting of both terminations.
3.3
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.
As the solder cools down, the solder contracts in the direction of the component. If there is too
much solder on the component, it has no leeway to evade the stress and may break, as in a vise.
Please read Cautions and warnings and
Important notes at the end of this document.
CeraDiodes
High-speed series
Soldering guidelines
Solder joint profiles / solder quantity
Cement quantity
Mounting the components on the board
Solder joint profiles
Page 13 of 22

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