39303056 Molex Inc, 39303056 Datasheet - Page 7

• Manufacturer Part Number: 39303056
• Description: CONN HEADER R/A TIN 5CKT
• Manufacturer: Molex Inc
• Series: Mini-Fit Jr™ 5566r

Specifications of 39303056

• Contact Type: Male Pin
• Connector Type: Header, Shrouded
• Number Of Positions: 5
• Number Of Positions Loaded: All
• Pitch: 0.165" (4.20mm)
• Number Of Rows: 1
• Mounting Type: Through Hole
• Termination: Solder
• Features: Board Lock
• Contact Finish: Tin
• Contact Finish Thickness: 200µin (5.08µm)
• Color: Natural
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Row Spacing: -
• Fastening Type: -
• Contact Mating Length: -
• Other names: 39303056; WM4272

5.0 PERFORMANCE
DOCUMENT NUMBER
SHEET
5.3.2 ENVIRONMENTAL PERFORMANCE (with Phos Bronze Material and Tin plating)
REV.
REV.
C
DESIGN CONTROL
TS-5556-002
REVISE ON PC ONLY
C
1
UCR
ES-40000-3996 REV. A SHEET 7 95/MAR/10 EC U5-0926 DCBRD07.LWP
Temperature Rise
C
2
BANDURA 02-4-18
Current Cycling
UCR2002-0869
DESCRIPTION
CONDITION
C
3
REVISED
TEST
&
C
4
STATUS
C
5
TEST SUMMARY
C
6
Wire
Awg
C
7
24
24
24
24
22
22
22
22
22
24
24
24
24
TITLE:
WRITTEN BY:
C
8
SAMIEC
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
Amps
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
1A
2A
3A
4A
1A
3A
4A
5A
1A
2A
3A
4A
2A
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
CHECKED BY:
BANDURA
Standard and Blind Mate Interface
REQUIREMENT
TEST SUMMARY
APPROVED
EDGLEY
Mini-Fit Jr.
(BMI)
Temp Rise
Degrees C
TS5556x2.LWP
17.6
30.2
13.4
21.4
31.8
18.2
30.2
Max
2.2
8.1
1.6
6.7
2.3
8.5
DATE:
FILENAME
99/07/09
LANGUAGE
YR/MO/DAY
English
SHEET
7