HF50ACB321611-T TDK Corporation, HF50ACB321611-T Datasheet - Page 2

• Manufacturer Part Number: HF50ACB321611-T
• Description: FERRITE CHIP 31 OHM 500MA 1206
• Manufacturer: TDK Corporation
• Series: HF50ACBr

Specifications of HF50ACB321611-T

• Package / Case: 1206 (3216 Metric)
• Impedance @ Frequency: 31 Ohm @ 100MHz
• Current Rating: 500mA
• Dc Resistance (dcr): 200 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Mounting Type: Surface Mount
• Shielding: Unshielded
• Test Frequency: 100 MHz
• Impedance: 31 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 50 Amps
• Maximum Dc Resistance: 31 Ohms
• Operating Temperature Range: - 20 C to + 120 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 445-6170-2

Chip Beads(SMD)
For Signal Line
HF70ACB, HF50ACB, HF30ACB Series
FEATURES
• This extensive series completely covers impedance values
• The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30
• These components are applicable for both flow and reflow
• Available reflow soldering.
• It is a product conforming to RoHS directive.
PRODUCT IDENTIFICATION
(1) Material name
(2) Series name
(3) Dimension code
(4) Packaging style
TEMPERATURE RANGES
Operating
Storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
HF70 ACB 201209 - T
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
(1)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
ranging from 7 to 125Ω [100MHz] and can be applied to a wide
range of circuits.
materials. The most suitable component can be selected for the
circuit pattern and the suppression band.
solderings, and have outstanding physical characteristics such
as excellent terminal strength, body strength, resistance to
soldering heat, solderability and mounting reliability.
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
T: ø180mm reel taping
TL: ø330mm reel taping
(2)
(3)
Type
201209
321611
322513
453215
(4)
–40 to +125°C
–40 to +125°C
Quantity
2000 pieces/reel
2000 pieces/reel
2000 pieces/reel
1000 pieces/reel
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
Type
201209
321611
322513
453215
RECOMMENDED PC BOARD PATTERN
REFLOW SOLDERING
Type
201209
321611
322513
453215
a
D
L
b
L
2.0±0.2
3.2±0.2
3.2±0.2
4.5±0.25
a
1.0
1.1
1.1
1.5
Insulation resin
a
Terminal
electrode
Ferrite
W
1.25±0.2
1.6±0.2
2.5±0.2
3.2±0.25
b
1.0
2.2
2.2
3.0
001-02 / 20101125 / e9415_hf_acb.fm
Resist
Land pattern
Conformity to RoHS Directive
Dimensions in mm
T
0.9±0.2
1.1±0.2
1.3±0.2
1.5±0.25
c
1.0
1.4
2.3
3.0
No directionality
Dimensions in mm
D
0.3±0.2
0.3±0.2
0.3±0.2
0.3±0.2
(1/3)